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Signal Integrity Analysis for High Speed Digital Circuit

This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solution...

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Main Authors: Ting, Mei Shang, Lee, Sheng Chyan, Sebastian , Patrick
Format: Conference or Workshop Item
Published: 2010
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utp.edu.my/3389/1/1569275119_%282%29-new.pdf
http://eprints.utp.edu.my/3389/
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spelling my.utp.eprints.33892017-01-19T08:23:54Z Signal Integrity Analysis for High Speed Digital Circuit Ting, Mei Shang Lee, Sheng Chyan Sebastian , Patrick TK Electrical engineering. Electronics Nuclear engineering This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper. 2010-07-07 Conference or Workshop Item PeerReviewed application/pdf http://eprints.utp.edu.my/3389/1/1569275119_%282%29-new.pdf Ting, Mei Shang and Lee, Sheng Chyan and Sebastian , Patrick (2010) Signal Integrity Analysis for High Speed Digital Circuit. In: 2010 International Conference on Intelligent and Advanced Systems, 15-17 June 2010, Kuala Lumpur. http://eprints.utp.edu.my/3389/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Ting, Mei Shang
Lee, Sheng Chyan
Sebastian , Patrick
Signal Integrity Analysis for High Speed Digital Circuit
description This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper.
format Conference or Workshop Item
author Ting, Mei Shang
Lee, Sheng Chyan
Sebastian , Patrick
author_facet Ting, Mei Shang
Lee, Sheng Chyan
Sebastian , Patrick
author_sort Ting, Mei Shang
title Signal Integrity Analysis for High Speed Digital Circuit
title_short Signal Integrity Analysis for High Speed Digital Circuit
title_full Signal Integrity Analysis for High Speed Digital Circuit
title_fullStr Signal Integrity Analysis for High Speed Digital Circuit
title_full_unstemmed Signal Integrity Analysis for High Speed Digital Circuit
title_sort signal integrity analysis for high speed digital circuit
publishDate 2010
url http://eprints.utp.edu.my/3389/1/1569275119_%282%29-new.pdf
http://eprints.utp.edu.my/3389/
_version_ 1738655263662014464
score 13.211869

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