Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a print...
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Main Authors: | , , |
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Format: | Citation Index Journal |
Published: |
2009
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Online Access: | http://eprints.utp.edu.my/279/1/paper.pdf http://www.scopus.com/inward/record.url?eid=2-s2.0-64549162388&partnerID=40&md5=6b3a42b63f2c9665cebf28094974b410 http://eprints.utp.edu.my/279/ |
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