Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes
In this work, a CMOS compatible surface acoustic wave (SAW) device has been simulated and analyzed on SiO2/AlN/SiO2/Si. The simulation results have been used to characterize a typical fabricated device as well. The phase velocity, coupling coefficient, and temperature coefficient of frequency (TCF)...
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my.utp.eprints.231942021-08-19T06:09:42Z Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes Aslam, M.Z. Jeoti, V. Karuppanan, S. Pandian, M.S. Ferrer, E.M. Suresh, K. In this work, a CMOS compatible surface acoustic wave (SAW) device has been simulated and analyzed on SiO2/AlN/SiO2/Si. The simulation results have been used to characterize a typical fabricated device as well. The phase velocity, coupling coefficient, and temperature coefficient of frequency (TCF) of surface acoustic waves in the proposed structure have been investigated using the finite-element (FE) simulation. The simulation results show that a high velocity and a large effective coupling factor can be simultaneously obtained. Besides, the excellent nearly zero TCF is also achieved. The analysis further shows potential for designing high-frequency SAW devices that are CMOS compatible and temperature stable utilizing the Sezawa wave mode. © 2020 Elsevier B.V. Elsevier B.V. 2020 Article NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85088260385&doi=10.1016%2fj.sna.2020.112202&partnerID=40&md5=b47de403ee17ece178370963e4f8e3ae Aslam, M.Z. and Jeoti, V. and Karuppanan, S. and Pandian, M.S. and Ferrer, E.M. and Suresh, K. (2020) Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes. Sensors and Actuators, A: Physical, 313 . http://eprints.utp.edu.my/23194/ |
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In this work, a CMOS compatible surface acoustic wave (SAW) device has been simulated and analyzed on SiO2/AlN/SiO2/Si. The simulation results have been used to characterize a typical fabricated device as well. The phase velocity, coupling coefficient, and temperature coefficient of frequency (TCF) of surface acoustic waves in the proposed structure have been investigated using the finite-element (FE) simulation. The simulation results show that a high velocity and a large effective coupling factor can be simultaneously obtained. Besides, the excellent nearly zero TCF is also achieved. The analysis further shows potential for designing high-frequency SAW devices that are CMOS compatible and temperature stable utilizing the Sezawa wave mode. © 2020 Elsevier B.V. |
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Article |
author |
Aslam, M.Z. Jeoti, V. Karuppanan, S. Pandian, M.S. Ferrer, E.M. Suresh, K. |
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Aslam, M.Z. Jeoti, V. Karuppanan, S. Pandian, M.S. Ferrer, E.M. Suresh, K. Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
author_facet |
Aslam, M.Z. Jeoti, V. Karuppanan, S. Pandian, M.S. Ferrer, E.M. Suresh, K. |
author_sort |
Aslam, M.Z. |
title |
Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
title_short |
Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
title_full |
Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
title_fullStr |
Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
title_full_unstemmed |
Surface acoustic wave modes characteristics of CMOS compatible SiO2/AlN/SiO2/Si multilayer structure with embedded electrodes |
title_sort |
surface acoustic wave modes characteristics of cmos compatible sio2/aln/sio2/si multilayer structure with embedded electrodes |
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Elsevier B.V. |
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2020 |
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https://www.scopus.com/inward/record.uri?eid=2-s2.0-85088260385&doi=10.1016%2fj.sna.2020.112202&partnerID=40&md5=b47de403ee17ece178370963e4f8e3ae http://eprints.utp.edu.my/23194/ |
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