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Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection

Modeling and simulation of a micromachined microhotplate (MHP) designed to achieve low power dissipation and uniform temperature distribution on the sensing area at operating temperatures of up to 700°C is presented in this paper. At the operating temperature of 700°C, it is demonstrated that as the...

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Main Authors: Dennis , John Ojur, Ahmed, Abdelaziz Yousif, Mohamad, Naufal Mohamad
Format: Citation Index Journal
Published: publisher@ijens.org 2010
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utp.edu.my/1151/1/IJENS.pdf
http://www.ijens.org
http://eprints.utp.edu.my/1151/
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spelling my.utp.eprints.11512017-01-19T08:24:20Z Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection Dennis , John Ojur Ahmed, Abdelaziz Yousif Mohamad, Naufal Mohamad TK Electrical engineering. Electronics Nuclear engineering Modeling and simulation of a micromachined microhotplate (MHP) designed to achieve low power dissipation and uniform temperature distribution on the sensing area at operating temperatures of up to 700°C is presented in this paper. At the operating temperature of 700°C, it is demonstrated that as the silicon nitride (Si3N4) and silicon carbide (SiC) membrane and heat distributor layer, respectively, is increased from 0.3 μm to 3 μm, the power dissipation of the MHP increases while the mechanical displacement of the MHP membrane decreases. On the other hand, the temperature gradient on the MHP decreases as the thickness of the SiC temperature distributor layer is increased and is a minimum with a value of 0.005°C/μm for SiC thickness of 2 μm and above. However for an increase in the tin dioxide (SnO2) thickness from 0.3 μm to 3 μm, the power dissipation on the MHP is not affected while the mechanical displacement decreases. A comparison between simulation and mathematically modeled results for power dissipation and current density of the MHP showed close agreement. An optimized simulated device exhibited low power dissipation of 9.25 mW and minimum mechanical deflection of 1.2 μm at the elevated temperature of 700°C. publisher@ijens.org 2010-04-10 Citation Index Journal PeerReviewed application/pdf http://eprints.utp.edu.my/1151/1/IJENS.pdf http://www.ijens.org Dennis , John Ojur and Ahmed, Abdelaziz Yousif and Mohamad, Naufal Mohamad (2010) Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection. [Citation Index Journal] http://eprints.utp.edu.my/1151/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Dennis , John Ojur
Ahmed, Abdelaziz Yousif
Mohamad, Naufal Mohamad
Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
description Modeling and simulation of a micromachined microhotplate (MHP) designed to achieve low power dissipation and uniform temperature distribution on the sensing area at operating temperatures of up to 700°C is presented in this paper. At the operating temperature of 700°C, it is demonstrated that as the silicon nitride (Si3N4) and silicon carbide (SiC) membrane and heat distributor layer, respectively, is increased from 0.3 μm to 3 μm, the power dissipation of the MHP increases while the mechanical displacement of the MHP membrane decreases. On the other hand, the temperature gradient on the MHP decreases as the thickness of the SiC temperature distributor layer is increased and is a minimum with a value of 0.005°C/μm for SiC thickness of 2 μm and above. However for an increase in the tin dioxide (SnO2) thickness from 0.3 μm to 3 μm, the power dissipation on the MHP is not affected while the mechanical displacement decreases. A comparison between simulation and mathematically modeled results for power dissipation and current density of the MHP showed close agreement. An optimized simulated device exhibited low power dissipation of 9.25 mW and minimum mechanical deflection of 1.2 μm at the elevated temperature of 700°C.
format Citation Index Journal
author Dennis , John Ojur
Ahmed, Abdelaziz Yousif
Mohamad, Naufal Mohamad
author_facet Dennis , John Ojur
Ahmed, Abdelaziz Yousif
Mohamad, Naufal Mohamad
author_sort Dennis , John Ojur
title Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
title_short Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
title_full Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
title_fullStr Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
title_full_unstemmed Design, Simulation and Modeling of a Micromachined High Temperature Microhotplate for Application in Trace Gas Detection
title_sort design, simulation and modeling of a micromachined high temperature microhotplate for application in trace gas detection
publisher publisher@ijens.org
publishDate 2010
url http://eprints.utp.edu.my/1151/1/IJENS.pdf
http://www.ijens.org
http://eprints.utp.edu.my/1151/
_version_ 1738655110648561664
score 13.211869

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