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Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study

Studies on temperature distribution in parallel plate treatment chambers are limited due to its design which is more prone to arcing, thus, neglecting its use in continuous processing. Therefore, this study discusses the temperature distribution due to Joule heating in a parallel plate treatment cha...

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Main Authors: Kasri, Nur Faizal, Mohamed Piah, Mohamed Afendi, Adzis, Zuraimy, Hamzah, A.
Format: Article
Language:English
Published: Penerbit UTM Press 2022
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/99456/1/MohamedAfendi2022_TemperatureDistributionAnalysisinParallelPlateTreatment.pdf
http://eprints.utm.my/id/eprint/99456/
http://dx.doi.org/10.11113/AEJ.V12.16551
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spelling my.utm.994562023-02-27T06:46:46Z http://eprints.utm.my/id/eprint/99456/ Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study Kasri, Nur Faizal Mohamed Piah, Mohamed Afendi Adzis, Zuraimy Hamzah, A. TK Electrical engineering. Electronics Nuclear engineering Studies on temperature distribution in parallel plate treatment chambers are limited due to its design which is more prone to arcing, thus, neglecting its use in continuous processing. Therefore, this study discusses the temperature distribution due to Joule heating in a parallel plate treatment chamber acting in continuous mode. The numerical results predict that at a slow flow rate (i.e., 0.0234 cm3/s), the fluid flow near the chamber wall is in a static state (0 cm/s), thus, increasing its residence time and resulting in receiving more pulses. In this situation, the temperature increased dramatically from 25 °C (inlet temperature) to approximately 58 °C, i.e., 132 % increment. On the other hand, a slight increase in temperature (i.e., < 27 °C) is predicted by numerical simulation at a higher flow rate (i.e., 0.138 cm3/s) at the same location (near the chamber wall). This less rise is due to the low residence time which causes the liquid to quickly leave the treatment area, thus, getting less pulse. The temperature soar in this condition is very low which is approximately 8 % of the inlet temperature. From the results obtained, flow rate control helps to reduce the temperature rise, thus, keeping the temperature at ambient temperature or slightly above the ambient and at the same time reducing the risk of the treated media from experiencing adverse effects on its physical attributes as a result of high temperatures. Penerbit UTM Press 2022 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/99456/1/MohamedAfendi2022_TemperatureDistributionAnalysisinParallelPlateTreatment.pdf Kasri, Nur Faizal and Mohamed Piah, Mohamed Afendi and Adzis, Zuraimy and Hamzah, A. (2022) Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study. ASEAN Engineering Journal, 12 (3). pp. 63-69. ISSN 2586-9159 http://dx.doi.org/10.11113/AEJ.V12.16551 DOI : 10.11113/AEJ.V12.16551
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Kasri, Nur Faizal
Mohamed Piah, Mohamed Afendi
Adzis, Zuraimy
Hamzah, A.
Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
description Studies on temperature distribution in parallel plate treatment chambers are limited due to its design which is more prone to arcing, thus, neglecting its use in continuous processing. Therefore, this study discusses the temperature distribution due to Joule heating in a parallel plate treatment chamber acting in continuous mode. The numerical results predict that at a slow flow rate (i.e., 0.0234 cm3/s), the fluid flow near the chamber wall is in a static state (0 cm/s), thus, increasing its residence time and resulting in receiving more pulses. In this situation, the temperature increased dramatically from 25 °C (inlet temperature) to approximately 58 °C, i.e., 132 % increment. On the other hand, a slight increase in temperature (i.e., < 27 °C) is predicted by numerical simulation at a higher flow rate (i.e., 0.138 cm3/s) at the same location (near the chamber wall). This less rise is due to the low residence time which causes the liquid to quickly leave the treatment area, thus, getting less pulse. The temperature soar in this condition is very low which is approximately 8 % of the inlet temperature. From the results obtained, flow rate control helps to reduce the temperature rise, thus, keeping the temperature at ambient temperature or slightly above the ambient and at the same time reducing the risk of the treated media from experiencing adverse effects on its physical attributes as a result of high temperatures.
format Article
author Kasri, Nur Faizal
Mohamed Piah, Mohamed Afendi
Adzis, Zuraimy
Hamzah, A.
author_facet Kasri, Nur Faizal
Mohamed Piah, Mohamed Afendi
Adzis, Zuraimy
Hamzah, A.
author_sort Kasri, Nur Faizal
title Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
title_short Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
title_full Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
title_fullStr Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
title_full_unstemmed Temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: Numerical study
title_sort temperature distribution analysis in parallel plate treatment chamber for pulsed electric field processing: numerical study
publisher Penerbit UTM Press
publishDate 2022
url http://eprints.utm.my/id/eprint/99456/1/MohamedAfendi2022_TemperatureDistributionAnalysisinParallelPlateTreatment.pdf
http://eprints.utm.my/id/eprint/99456/
http://dx.doi.org/10.11113/AEJ.V12.16551
_version_ 1758966900586446848
score 13.211869

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