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A fast and flexible turret based Automated Vision Inspection (AVI) to inspect 6 sides of small discrete components

Smart devices components come in a variety of shapes, sizes and texture. To perform a high throughput inspection on all the six sides of the surface of the component is challenging due to tolerances of product dimension and the multiple planes on its surface. The image acquisition system for surface...

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書誌詳細
主要な著者:	Loo, Kean Li, Chong, Keat Saw, Ibrahim, M. H.
フォーマット:	Conference or Workshop Item
出版事項:	2022
主題:	TK Electrical engineering. Electronics Nuclear engineering
オンライン･アクセス:	http://eprints.utm.my/id/eprint/99410/ http://dx.doi.org/10.1007/978-981-16-8129-5_8
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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