Cover Image

A new finite element formulation for thin non-homogenous heat-conducting adhesive layers

A thin heat-conducting adhesive layer is considered in a two-dimensional approach. The material of the adhesive layer exhibits an arbitrary non-homogeneous thermal conductivity which is a function of the spatial coordinate perpendicular to the interface. Based on the weighted residual method, a new...

Full description

Saved in:
Bibliographic Details
Main Authors: Ochsner, Andreas, Mishuris, Gennady
Format: Article
Published: VSP 2008
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/8195/
http://dx.doi.org/10.1163/156856108X309558
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.8195
record_format eprints
spelling my.utm.81952009-04-02T03:45:34Z http://eprints.utm.my/id/eprint/8195/ A new finite element formulation for thin non-homogenous heat-conducting adhesive layers Ochsner, Andreas Mishuris, Gennady TJ Mechanical engineering and machinery A thin heat-conducting adhesive layer is considered in a two-dimensional approach. The material of the adhesive layer exhibits an arbitrary non-homogeneous thermal conductivity which is a function of the spatial coordinate perpendicular to the interface. Based on the weighted residual method, a new finite element formulation for a four-node, rectangular element is derived which is able to easily incorporate high conductivity gradients in the new thermal conductivity matrix. The approach is not based on any assumptions of the temperature distribution (e.g. linear or cubic) but considers that the heat flux must be constant in the case that no heat sources or sinks are present. A numerical example of a simple bonded joint illustrates the implementation into the commercial finite element code MSC.Marc due to special user subroutines. The numerical results are compared to a classical approach based on standard elements and the differences are discussed. VSP 2008 Article PeerReviewed Ochsner, Andreas and Mishuris, Gennady (2008) A new finite element formulation for thin non-homogenous heat-conducting adhesive layers. Journal of Adhesion Science and Technology, 22 (13). pp. 1365-1378. ISSN 0169-4243 http://dx.doi.org/10.1163/156856108X309558 10.1163/156856108X309558
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Ochsner, Andreas
Mishuris, Gennady
A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
description A thin heat-conducting adhesive layer is considered in a two-dimensional approach. The material of the adhesive layer exhibits an arbitrary non-homogeneous thermal conductivity which is a function of the spatial coordinate perpendicular to the interface. Based on the weighted residual method, a new finite element formulation for a four-node, rectangular element is derived which is able to easily incorporate high conductivity gradients in the new thermal conductivity matrix. The approach is not based on any assumptions of the temperature distribution (e.g. linear or cubic) but considers that the heat flux must be constant in the case that no heat sources or sinks are present. A numerical example of a simple bonded joint illustrates the implementation into the commercial finite element code MSC.Marc due to special user subroutines. The numerical results are compared to a classical approach based on standard elements and the differences are discussed.
format Article
author Ochsner, Andreas
Mishuris, Gennady
author_facet Ochsner, Andreas
Mishuris, Gennady
author_sort Ochsner, Andreas
title A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
title_short A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
title_full A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
title_fullStr A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
title_full_unstemmed A new finite element formulation for thin non-homogenous heat-conducting adhesive layers
title_sort new finite element formulation for thin non-homogenous heat-conducting adhesive layers
publisher VSP
publishDate 2008
url http://eprints.utm.my/id/eprint/8195/
http://dx.doi.org/10.1163/156856108X309558
_version_ 1643644939510218752
score 13.211869

Similar Items