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Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers

The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order to confirm the growth model the present authors had proposed, the process of recrystallization of tin was investigated. A single crystal of tin was prepared by using a slow-cooling method and plate sam...

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Main Authors: Lias, Marina, Kuwano, Noriyuki
Format: Conference or Workshop Item
Language:English
Published: 2015
Subjects:
TN Mining engineering. Metallurgy
Online Access:http://eprints.utm.my/id/eprint/61801/1/MarinaLias2015_ElectronMicroscpyStudyofDeformationandRecrystallization.pdf
http://eprints.utm.my/id/eprint/61801/
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spelling my.utm.618012017-08-09T04:17:38Z http://eprints.utm.my/id/eprint/61801/ Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers Lias, Marina Kuwano, Noriyuki TN Mining engineering. Metallurgy The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order to confirm the growth model the present authors had proposed, the process of recrystallization of tin was investigated. A single crystal of tin was prepared by using a slow-cooling method and plate samples were prepared by using a spark-cutter and electro-polishing. Deformation was applied to the plate samples by scratching. The microstructural changes with time at room temperature after scratching were observed by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). The experimental results showed clearly that recrystallization can proceed even at room temperature. A tensile test was also performed in order to investigate its ordinary deformation behavior. The present results have supported the model for tin whisker growth mechanism, suggesting that if the recrystallization phenomenon can be controlled to proceed homogenously in tin solder and plating, the whisker growth will be mitigated. 2015 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/61801/1/MarinaLias2015_ElectronMicroscpyStudyofDeformationandRecrystallization.pdf Lias, Marina and Kuwano, Noriyuki (2015) Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers. In: Malasia-Japan Joint International Conference, 13-15 Nov, 2015, Japan.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TN Mining engineering. Metallurgy
spellingShingle TN Mining engineering. Metallurgy
Lias, Marina
Kuwano, Noriyuki
Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
description The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order to confirm the growth model the present authors had proposed, the process of recrystallization of tin was investigated. A single crystal of tin was prepared by using a slow-cooling method and plate samples were prepared by using a spark-cutter and electro-polishing. Deformation was applied to the plate samples by scratching. The microstructural changes with time at room temperature after scratching were observed by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). The experimental results showed clearly that recrystallization can proceed even at room temperature. A tensile test was also performed in order to investigate its ordinary deformation behavior. The present results have supported the model for tin whisker growth mechanism, suggesting that if the recrystallization phenomenon can be controlled to proceed homogenously in tin solder and plating, the whisker growth will be mitigated.
format Conference or Workshop Item
author Lias, Marina
Kuwano, Noriyuki
author_facet Lias, Marina
Kuwano, Noriyuki
author_sort Lias, Marina
title Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
title_short Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
title_full Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
title_fullStr Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
title_full_unstemmed Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
title_sort electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers
publishDate 2015
url http://eprints.utm.my/id/eprint/61801/1/MarinaLias2015_ElectronMicroscpyStudyofDeformationandRecrystallization.pdf
http://eprints.utm.my/id/eprint/61801/
_version_ 1643655266058633216
score 13.211869

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