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Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider

Nowadays, the fifth generation (5G) wireless system is extensively studied to fulfill the continuously increasing demand for high data rate and mobility in wireless communication applications. Thus, to cope with this demand, various researches are required for front-end microwave components, which i...

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Main Authors: Yusof, Khairul Huda, Seman, Norhudah, Jamaluddin, Mohd. Haizal
Format: Article
Language:English
Published: Penerbit UTM Press 2015
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/57816/1/KhairulHuda2015_AnalysisonTheEffectofDielectricMaterial.pdf
http://eprints.utm.my/id/eprint/57816/
http://dx.doi.org/10.11113/jt.v77.6277
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spelling my.utm.578162021-12-15T09:10:39Z http://eprints.utm.my/id/eprint/57816/ Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider Yusof, Khairul Huda Seman, Norhudah Jamaluddin, Mohd. Haizal TK Electrical engineering. Electronics Nuclear engineering Nowadays, the fifth generation (5G) wireless system is extensively studied to fulfill the continuously increasing demand for high data rate and mobility in wireless communication applications. Thus, to cope with this demand, various researches are required for front-end microwave components, which includes power divider. Therefore, in this article, the design and analysis of ultra wideband T-shaped power divider is presented. Two substrates are chosen in the design, which are Rogers RO4003C and TMM4 with copper thickness of 17 µm and 35 µm to analyze their effect towards ultra wideband performance of the designed power divider. The design and analysis are performed by using CST Microwave Studio. The optimal performance of the designed power divider is subjected to dielectric material and the copper thickness of the substrate. Where, the best design is obtained using TMM4 substrate that made of ceramic thermoset polymer with 35 µm copper thickness. Penerbit UTM Press 2015 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/57816/1/KhairulHuda2015_AnalysisonTheEffectofDielectricMaterial.pdf Yusof, Khairul Huda and Seman, Norhudah and Jamaluddin, Mohd. Haizal (2015) Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider. Jurnal Teknologi, 77 (10). pp. 11-16. ISSN 0127-9696 http://dx.doi.org/10.11113/jt.v77.6277 DOI:10.11113/jt.v77.6277
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Yusof, Khairul Huda
Seman, Norhudah
Jamaluddin, Mohd. Haizal
Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
description Nowadays, the fifth generation (5G) wireless system is extensively studied to fulfill the continuously increasing demand for high data rate and mobility in wireless communication applications. Thus, to cope with this demand, various researches are required for front-end microwave components, which includes power divider. Therefore, in this article, the design and analysis of ultra wideband T-shaped power divider is presented. Two substrates are chosen in the design, which are Rogers RO4003C and TMM4 with copper thickness of 17 µm and 35 µm to analyze their effect towards ultra wideband performance of the designed power divider. The design and analysis are performed by using CST Microwave Studio. The optimal performance of the designed power divider is subjected to dielectric material and the copper thickness of the substrate. Where, the best design is obtained using TMM4 substrate that made of ceramic thermoset polymer with 35 µm copper thickness.
format Article
author Yusof, Khairul Huda
Seman, Norhudah
Jamaluddin, Mohd. Haizal
author_facet Yusof, Khairul Huda
Seman, Norhudah
Jamaluddin, Mohd. Haizal
author_sort Yusof, Khairul Huda
title Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
title_short Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
title_full Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
title_fullStr Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
title_full_unstemmed Analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted T-shaped power divider
title_sort analysis on the effect of dielectric material and copper thickness of substrate towards the performance of ultra wideband ground slotted t-shaped power divider
publisher Penerbit UTM Press
publishDate 2015
url http://eprints.utm.my/id/eprint/57816/1/KhairulHuda2015_AnalysisonTheEffectofDielectricMaterial.pdf
http://eprints.utm.my/id/eprint/57816/
http://dx.doi.org/10.11113/jt.v77.6277
_version_ 1720436853732016128
score 13.211869

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