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Quantitative defect characterization for passive thermography application

This article proposes a new method for characterizing subsurface defects in high temperature wall by means of passive thermography. The method enables a fast and reliable quantitative defect characterization. Ten informative parameters have been proposed for this purpose based on temperature behavio...

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Main Authors: Heriansyah, Rudi, Syed Abu Bakar, Syed Abdul Rahman, Nahhas, Ahmed Muhammad
Format: Article
Published: Taylor and Francis Ltd. 2015
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/55156/
http://www.tandfonline.com/doi/abs/10.1080/09349847.2015.1012248?journalCode=urnd20
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spelling my.utm.551562017-08-02T06:42:57Z http://eprints.utm.my/id/eprint/55156/ Quantitative defect characterization for passive thermography application Heriansyah, Rudi Syed Abu Bakar, Syed Abdul Rahman Nahhas, Ahmed Muhammad TK Electrical engineering. Electronics Nuclear engineering This article proposes a new method for characterizing subsurface defects in high temperature wall by means of passive thermography. The method enables a fast and reliable quantitative defect characterization. Ten informative parameters have been proposed for this purpose based on temperature behavior on the outer surface wall of a petrochemical boiler. Multilayer perceptron neural network has been trained to characterize quantitatively three defect properties: thickness, length, and width of the defect. From an extensive testing of the method, it has been shown that the method is able to characterize the defect properties, which actually we believe is a new approach in passive thermography application. Taylor and Francis Ltd. 2015-07-03 Article PeerReviewed Heriansyah, Rudi and Syed Abu Bakar, Syed Abdul Rahman and Nahhas, Ahmed Muhammad (2015) Quantitative defect characterization for passive thermography application. Research in Nondestructive Evaluation, 26 (3). pp. 133-153. ISSN 0934-9847 http://www.tandfonline.com/doi/abs/10.1080/09349847.2015.1012248?journalCode=urnd20
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Heriansyah, Rudi
Syed Abu Bakar, Syed Abdul Rahman
Nahhas, Ahmed Muhammad
Quantitative defect characterization for passive thermography application
description This article proposes a new method for characterizing subsurface defects in high temperature wall by means of passive thermography. The method enables a fast and reliable quantitative defect characterization. Ten informative parameters have been proposed for this purpose based on temperature behavior on the outer surface wall of a petrochemical boiler. Multilayer perceptron neural network has been trained to characterize quantitatively three defect properties: thickness, length, and width of the defect. From an extensive testing of the method, it has been shown that the method is able to characterize the defect properties, which actually we believe is a new approach in passive thermography application.
format Article
author Heriansyah, Rudi
Syed Abu Bakar, Syed Abdul Rahman
Nahhas, Ahmed Muhammad
author_facet Heriansyah, Rudi
Syed Abu Bakar, Syed Abdul Rahman
Nahhas, Ahmed Muhammad
author_sort Heriansyah, Rudi
title Quantitative defect characterization for passive thermography application
title_short Quantitative defect characterization for passive thermography application
title_full Quantitative defect characterization for passive thermography application
title_fullStr Quantitative defect characterization for passive thermography application
title_full_unstemmed Quantitative defect characterization for passive thermography application
title_sort quantitative defect characterization for passive thermography application
publisher Taylor and Francis Ltd.
publishDate 2015
url http://eprints.utm.my/id/eprint/55156/
http://www.tandfonline.com/doi/abs/10.1080/09349847.2015.1012248?journalCode=urnd20
_version_ 1643653711650619392
score 13.211869

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