Package power delivery analysis for unmerged and merged power rails
Power delivery design has become important and critical nowadays especially at the package level, interconnect between silicon and motherboard. It is not an easy task to perform power delivery analysis at package level as it could have more than 30 power rails and it is very time consuming to valida...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/48020/25/SeeTauYeemfke2014.pdf http://eprints.utm.my/id/eprint/48020/ |
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