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Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture

The implementations of parallel algorithms in solving partial differential equations (PDEs) for heat transfer problems are based on the high performance computing using distributed memory architecture. In this paper, the parallel algorithms are exploited finite difference method in solving multidime...

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Main Authors: Alias, Norma, Darwis, Roziha, Satam, Noriza, Othman, Mohamed
Format: Book Section
Published: Springer Verlag 2009
Subjects:
Q Science (General)
Online Access:http://eprints.utm.my/id/eprint/13037/
http://dx.doi.org/10.1007/978-3-642-03275-2_38
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spelling my.utm.130372011-07-14T01:22:14Z http://eprints.utm.my/id/eprint/13037/ Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture Alias, Norma Darwis, Roziha Satam, Noriza Othman, Mohamed Q Science (General) The implementations of parallel algorithms in solving partial differential equations (PDEs) for heat transfer problems are based on the high performance computing using distributed memory architecture. In this paper, the parallel algorithms are exploited finite difference method in solving multidimensional heat transfer problem for semiconductor components and polymer composite materials. Parallel Virtual Machine (PVM) and C language based on Linux operating system are the platform to run the parallel algorithms. This research focused on Red-Black Gauss Seidel (RBGS) iterative method. Parallel performance evaluations in terms of speedup, efficiency, effectiveness, temporal performance and communication cost are analyzed. Springer Verlag 2009 Book Section PeerReviewed Alias, Norma and Darwis, Roziha and Satam, Noriza and Othman, Mohamed (2009) Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture. In: Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). Springer Verlag, Germany, 392 -398. ISBN 978-364203274-5 http://dx.doi.org/10.1007/978-3-642-03275-2_38 doi:10.1007/978-3-642-03275-2_38
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic Q Science (General)
spellingShingle Q Science (General)
Alias, Norma
Darwis, Roziha
Satam, Noriza
Othman, Mohamed
Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
description The implementations of parallel algorithms in solving partial differential equations (PDEs) for heat transfer problems are based on the high performance computing using distributed memory architecture. In this paper, the parallel algorithms are exploited finite difference method in solving multidimensional heat transfer problem for semiconductor components and polymer composite materials. Parallel Virtual Machine (PVM) and C language based on Linux operating system are the platform to run the parallel algorithms. This research focused on Red-Black Gauss Seidel (RBGS) iterative method. Parallel performance evaluations in terms of speedup, efficiency, effectiveness, temporal performance and communication cost are analyzed.
format Book Section
author Alias, Norma
Darwis, Roziha
Satam, Noriza
Othman, Mohamed
author_facet Alias, Norma
Darwis, Roziha
Satam, Noriza
Othman, Mohamed
author_sort Alias, Norma
title Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
title_short Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
title_full Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
title_fullStr Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
title_full_unstemmed Parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
title_sort parallelization of temperature distribution simulations for semiconductor and polymer composite material on distributed memory architecture
publisher Springer Verlag
publishDate 2009
url http://eprints.utm.my/id/eprint/13037/
http://dx.doi.org/10.1007/978-3-642-03275-2_38
_version_ 1643646101321940992
score 13.211869

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