Thermal conductivity of stacked Hexagonal Boron Nitride (hBN) and Graphene-A molecular dynamics approach
Developing solutions to keep up with the needs of increased power output of contemporary microprocessors is an ongoing challenge in the electronics industry. As such, thermal interface materials, which act as a filler to smooth out the contact imperfections between heat source and heat sink have bee...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2023
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| Subjects: | |
| Online Access: | http://eprints.utm.my/108373/ http://dx.doi.org/10.1109/RSM59033.2023.10326763 |
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