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The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging

The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...

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Main Author: Chua, King Lee
Format: Thesis
Language:English
Published: 2004
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
Online Access:http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf
http://eprints.uthm.edu.my/7636/
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spelling my.uthm.eprints.76362022-09-08T02:12:53Z http://eprints.uthm.edu.my/7636/ The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging Chua, King Lee TK Electrical engineering. Electronics Nuclear engineering TK7800-8360 Electronics The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON Semiconductor where silver-filler epoxy�based adhesive chips were investigated. Tektronix 370B Programmable Curve Tracer with picoprobing is used to measure RoN of the chips. Nondestructive techniques such as X-ray and SAM used to examine internal defect and cross sectional analysis was done using SEM. Few factors were found affect RoN. Those factors are capacitance due to trap charges during fabrication, supply voltage, thermal management of the package, delamination between die attachments, thickness of the epox)' and copper dioxide of the lead-frame. 2004-03 Thesis NonPeerReviewed text en http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf Chua, King Lee (2004) The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging. Masters thesis, Universiti Kebangsaan Malaysia.
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
Chua, King Lee
The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
description The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON Semiconductor where silver-filler epoxy�based adhesive chips were investigated. Tektronix 370B Programmable Curve Tracer with picoprobing is used to measure RoN of the chips. Nondestructive techniques such as X-ray and SAM used to examine internal defect and cross sectional analysis was done using SEM. Few factors were found affect RoN. Those factors are capacitance due to trap charges during fabrication, supply voltage, thermal management of the package, delamination between die attachments, thickness of the epox)' and copper dioxide of the lead-frame.
format Thesis
author Chua, King Lee
author_facet Chua, King Lee
author_sort Chua, King Lee
title The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_short The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_full The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_fullStr The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_full_unstemmed The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_sort investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
publishDate 2004
url http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf
http://eprints.uthm.edu.my/7636/
_version_ 1744355842098987008
score 13.211869

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