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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCN...

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Main Authors: Dele-Afolabi, T. T., M. A., Azmah Hanim, K., Vidyatharran, K. A., Matori, O., Saliza Azlina, R., Calin
Format: Article
Language:English
Published: Springer Link 2022
Subjects:
T Technology (General)
Online Access:http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf
http://eprints.uthm.edu.my/7099/
https://doi.org/10.1007/s10854-022-07974-8
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spelling my.uthm.eprints.70992022-05-31T07:20:54Z http://eprints.uthm.edu.my/7099/ Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish Dele-Afolabi, T. T. M. A., Azmah Hanim K., Vidyatharran K. A., Matori O., Saliza Azlina R., Calin T Technology (General) The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1wt%) were successfully synthesized through the powdermetallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finishmaterial, the SAC-xCNT/ENIAg exhibited IMC thickness valueswithin the range of 2.98–2.65 lm as compared to the 5.23–3.61 lm demonstrated by the SAC�xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibit�ing the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively. Springer Link 2022 Article PeerReviewed text en http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf Dele-Afolabi, T. T. and M. A., Azmah Hanim and K., Vidyatharran and K. A., Matori and O., Saliza Azlina and R., Calin (2022) Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics volume, 33. ISSN 8233–8246 https://doi.org/10.1007/s10854-022-07974-8
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
language English
topic T Technology (General)
spellingShingle T Technology (General)
Dele-Afolabi, T. T.
M. A., Azmah Hanim
K., Vidyatharran
K. A., Matori
O., Saliza Azlina
R., Calin
Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
description The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1wt%) were successfully synthesized through the powdermetallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finishmaterial, the SAC-xCNT/ENIAg exhibited IMC thickness valueswithin the range of 2.98–2.65 lm as compared to the 5.23–3.61 lm demonstrated by the SAC�xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibit�ing the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively.
format Article
author Dele-Afolabi, T. T.
M. A., Azmah Hanim
K., Vidyatharran
K. A., Matori
O., Saliza Azlina
R., Calin
author_facet Dele-Afolabi, T. T.
M. A., Azmah Hanim
K., Vidyatharran
K. A., Matori
O., Saliza Azlina
R., Calin
author_sort Dele-Afolabi, T. T.
title Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
title_short Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
title_full Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
title_fullStr Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
title_full_unstemmed Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
title_sort interfacial microstructure evolution and shear strength of mwcnts-reinforced sn-1.0ag-0.5cu (sac105) composite solder interconnects on plain cu and eniag surface finish
publisher Springer Link
publishDate 2022
url http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf
http://eprints.uthm.edu.my/7099/
https://doi.org/10.1007/s10854-022-07974-8
_version_ 1738581576091959296
score 13.211869

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