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Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispe...

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Main Authors: M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq
Format: Article
Published: Wiley-VCH Verlag 2020
Subjects:
TN Mining engineering. Metallurgy
Online Access:http://eprints.uthm.edu.my/6380/
https://dx.doi.org/ 10.1002/mawe.201900246
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spelling my.uthm.eprints.63802022-01-30T08:12:52Z http://eprints.uthm.edu.my/6380/ Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate M.A., Rabiatul Adawiyah S.A., Amirul O., Saliza Azlina H., Syafiq TN Mining engineering. Metallurgy The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispersive x-ray analysis. A layer of continuous (Cu, Ni)6Sn5 and discontinuous (Ni, Cu)3Sn4 intermetallic were formed at the interface after up to the third reflow, while Ag3Sn nanosized was formed on the intermetallic surface. The total thickness of the intermetallic layer increased as the reflow increased. The findings also revealed that the intermetallic thickness became thicker with the mass percentage of nickel increased. Hence, the intermetallic growth was controlled mainly by reflow times and nickel content in solders. Wiley-VCH Verlag 2020 Article PeerReviewed M.A., Rabiatul Adawiyah and S.A., Amirul and O., Saliza Azlina and H., Syafiq (2020) Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate. Materialwissenschaft und Werkstofftechnik, 51 (6). pp. 780-786. ISSN 0933-5137 https://dx.doi.org/ 10.1002/mawe.201900246
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
topic TN Mining engineering. Metallurgy
spellingShingle TN Mining engineering. Metallurgy
M.A., Rabiatul Adawiyah
S.A., Amirul
O., Saliza Azlina
H., Syafiq
Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
description The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispersive x-ray analysis. A layer of continuous (Cu, Ni)6Sn5 and discontinuous (Ni, Cu)3Sn4 intermetallic were formed at the interface after up to the third reflow, while Ag3Sn nanosized was formed on the intermetallic surface. The total thickness of the intermetallic layer increased as the reflow increased. The findings also revealed that the intermetallic thickness became thicker with the mass percentage of nickel increased. Hence, the intermetallic growth was controlled mainly by reflow times and nickel content in solders.
format Article
author M.A., Rabiatul Adawiyah
S.A., Amirul
O., Saliza Azlina
H., Syafiq
author_facet M.A., Rabiatul Adawiyah
S.A., Amirul
O., Saliza Azlina
H., Syafiq
author_sort M.A., Rabiatul Adawiyah
title Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
title_short Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
title_full Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
title_fullStr Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
title_full_unstemmed Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
title_sort impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on enimag substrate
publisher Wiley-VCH Verlag
publishDate 2020
url http://eprints.uthm.edu.my/6380/
https://dx.doi.org/ 10.1002/mawe.201900246
_version_ 1738581485657522176
score 13.211869

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