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Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free sold...

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Main Authors: M.A., Rabiatul Adawiyah, O., Saliza Azlina
Format: Article
Language:English
Published: ScienceDirect 2018
Subjects:
T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf
http://eprints.uthm.edu.my/5599/
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spelling my.uthm.eprints.55992022-01-17T01:56:03Z http://eprints.uthm.edu.my/5599/ Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints M.A., Rabiatul Adawiyah O., Saliza Azlina T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free solders, Sn-3.0Ag-0.5Cu (SAC305) and Sn-4.0Ag-0.5Cu (SAC405) were involved along with ENImAg and bare copper substrate in order to investigate the formation of intermetallic compounds (IMCs) under reflow and aging time. The characterization and analysis of the samples conducted through scanning electron microscopy and energy dispersive x-ray. As a result, the IMCs of SAC/Cu which were formed on the interface were Cu6Sn5 and Cu3Sn. Unlike the reaction displayed by SAC/Cu, the IMCs of SAC/ENImAg which were formed on the interfaces, were identified as (Cu,Ni)6Sn5) and (Ni,Cu)3Sn4. The kinetic growth of each IMC was analyzed. It was found that IMC of SAC/Cu was thicker than IMC of SAC/ENImAg. Upon the revelation of these observations, ENImAg surface finish reduced the growth of IMC and smaller grains size compared to bare Cu. ScienceDirect 2018 Article PeerReviewed text en http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf M.A., Rabiatul Adawiyah and O., Saliza Azlina (2018) Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints. Journal of Alloys and Compounds, 740. pp. 958-966. ISSN 0925-8388
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
language English
topic T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
spellingShingle T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
M.A., Rabiatul Adawiyah
O., Saliza Azlina
Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
description The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free solders, Sn-3.0Ag-0.5Cu (SAC305) and Sn-4.0Ag-0.5Cu (SAC405) were involved along with ENImAg and bare copper substrate in order to investigate the formation of intermetallic compounds (IMCs) under reflow and aging time. The characterization and analysis of the samples conducted through scanning electron microscopy and energy dispersive x-ray. As a result, the IMCs of SAC/Cu which were formed on the interface were Cu6Sn5 and Cu3Sn. Unlike the reaction displayed by SAC/Cu, the IMCs of SAC/ENImAg which were formed on the interfaces, were identified as (Cu,Ni)6Sn5) and (Ni,Cu)3Sn4. The kinetic growth of each IMC was analyzed. It was found that IMC of SAC/Cu was thicker than IMC of SAC/ENImAg. Upon the revelation of these observations, ENImAg surface finish reduced the growth of IMC and smaller grains size compared to bare Cu.
format Article
author M.A., Rabiatul Adawiyah
O., Saliza Azlina
author_facet M.A., Rabiatul Adawiyah
O., Saliza Azlina
author_sort M.A., Rabiatul Adawiyah
title Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
title_short Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
title_full Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
title_fullStr Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
title_full_unstemmed Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
title_sort comparative study on the isothermal aging of bare cu and enimag surface finish for sn-ag-cu solder joints
publisher ScienceDirect
publishDate 2018
url http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf
http://eprints.uthm.edu.my/5599/
_version_ 1738581395280756736
score 13.211869

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