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Microstructural Analysis of Intermetallic Ni5Al3 Thin Films

The possible magnetic transition phenomenon obtained is postulated particularly on the Nickel Aluminum (Ni5Al3) thin films of different thickness. It was found that the film resistance exhibits a linear but mild increase over the initial temperature range, followed by a transition to a relatively ra...

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Main Authors: Joseph Sahaya Anand, T, Ngan, A.H.W.
Format: Article
Language:English
Published: Faculty of Mechanical Engineering, UTeM 2010
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/6495/1/JMET_2010.pdf
http://eprints.utem.edu.my/id/eprint/6495/
http://www.utem.edu.my/fkm/
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spelling my.utem.eprints.64952015-05-28T03:43:04Z http://eprints.utem.edu.my/id/eprint/6495/ Microstructural Analysis of Intermetallic Ni5Al3 Thin Films Joseph Sahaya Anand, T Ngan, A.H.W. TJ Mechanical engineering and machinery The possible magnetic transition phenomenon obtained is postulated particularly on the Nickel Aluminum (Ni5Al3) thin films of different thickness. It was found that the film resistance exhibits a linear but mild increase over the initial temperature range, followed by a transition to a relatively rapid decline in the resistance after attaining maximum at ~170ºC. This positive temperature coefficient of resistance (TCR) makes this material suitable for magneto resistor applications. The same observations were made on two different sputtering systems with different deposition conditions, indicating that the magnetic transition is a highly reproducible phenomenon. Faculty of Mechanical Engineering, UTeM 2010 Article PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/6495/1/JMET_2010.pdf Joseph Sahaya Anand, T and Ngan, A.H.W. (2010) Microstructural Analysis of Intermetallic Ni5Al3 Thin Films. Journal of Mechanical Engineering and Technology, 2 (1). pp. 25-39. ISSN 2180-1053 http://www.utem.edu.my/fkm/
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Joseph Sahaya Anand, T
Ngan, A.H.W.
Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
description The possible magnetic transition phenomenon obtained is postulated particularly on the Nickel Aluminum (Ni5Al3) thin films of different thickness. It was found that the film resistance exhibits a linear but mild increase over the initial temperature range, followed by a transition to a relatively rapid decline in the resistance after attaining maximum at ~170ºC. This positive temperature coefficient of resistance (TCR) makes this material suitable for magneto resistor applications. The same observations were made on two different sputtering systems with different deposition conditions, indicating that the magnetic transition is a highly reproducible phenomenon.
format Article
author Joseph Sahaya Anand, T
Ngan, A.H.W.
author_facet Joseph Sahaya Anand, T
Ngan, A.H.W.
author_sort Joseph Sahaya Anand, T
title Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
title_short Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
title_full Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
title_fullStr Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
title_full_unstemmed Microstructural Analysis of Intermetallic Ni5Al3 Thin Films
title_sort microstructural analysis of intermetallic ni5al3 thin films
publisher Faculty of Mechanical Engineering, UTeM
publishDate 2010
url http://eprints.utem.edu.my/id/eprint/6495/1/JMET_2010.pdf
http://eprints.utem.edu.my/id/eprint/6495/
http://www.utem.edu.my/fkm/
_version_ 1665905312833470464
score 13.211869

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