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APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pa...

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Main Author: Sivakumar, Dhar Malingam
Format: Conference or Workshop Item
Language:English
Published: 2004
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf
http://eprints.utem.edu.my/id/eprint/4312/
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spelling my.utem.eprints.43122015-05-28T02:41:04Z http://eprints.utem.edu.my/id/eprint/4312/ APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY Sivakumar, Dhar Malingam TJ Mechanical engineering and machinery Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pad (NSOP), which was the top yield lost contributor. Floating die contributed 48% of the NSOP defect. How Focus Improvement activity is used to reduce Non Stick on Pad due to floating die is shown. As a result NSOP due to floating die had been reduced from 1300 parts per million (ppm) to 650 ppm a reduction of 50% within one year. 2004 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf Sivakumar, Dhar Malingam (2004) APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY. In: 3rd INTERNATIONAL CONFERENCE ON ADVANCED MANUFACTURING TECHNOLOGY (ICAMT 2004), 11-13 May 2004, Kuala Lumpur, Malaysia.
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Sivakumar, Dhar Malingam
APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
description Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pad (NSOP), which was the top yield lost contributor. Floating die contributed 48% of the NSOP defect. How Focus Improvement activity is used to reduce Non Stick on Pad due to floating die is shown. As a result NSOP due to floating die had been reduced from 1300 parts per million (ppm) to 650 ppm a reduction of 50% within one year.
format Conference or Workshop Item
author Sivakumar, Dhar Malingam
author_facet Sivakumar, Dhar Malingam
author_sort Sivakumar, Dhar Malingam
title APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
title_short APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
title_full APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
title_fullStr APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
title_full_unstemmed APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
title_sort application of total productive maintenance to reduce non-stick on pad problem in a semiconductor industry
publishDate 2004
url http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf
http://eprints.utem.edu.my/id/eprint/4312/
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score 13.211869

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