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Mechanical modelling and analysis of CMOS image sensor package

The growth of automotive industry not only focus on power efficiency and carbon emission reduction, it also has makes further progress in the areas of advanced driver assistance systems (ADAS) and autonomous driving (AD) technologies. With the progressive technology breakthrough and heavily studies...

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Main Authors: Lim, T.S., Sukiman, Muhamad Shafiq, Jasmee, Solehah, Masdzarif, Nur Diana Izzani
Format: Conference or Workshop Item
Language:English
Published: 2023
Online Access:http://eprints.utem.edu.my/id/eprint/28008/1/Mechanical%20modelling%20and%20analysis%20of%20CMOS%20image%20sensor%20package.pdf
http://eprints.utem.edu.my/id/eprint/28008/
https://ieeexplore.ieee.org/document/10457582
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spelling my.utem.eprints.280082024-10-17T08:20:17Z http://eprints.utem.edu.my/id/eprint/28008/ Mechanical modelling and analysis of CMOS image sensor package Lim, T.S. Sukiman, Muhamad Shafiq Jasmee, Solehah Masdzarif, Nur Diana Izzani The growth of automotive industry not only focus on power efficiency and carbon emission reduction, it also has makes further progress in the areas of advanced driver assistance systems (ADAS) and autonomous driving (AD) technologies. With the progressive technology breakthrough and heavily studies in these two areas, the demand for imaging cameras is steadily increasing to support applications such as lane detection, traffic sign detection, pedestrian/vehicle recognition and driver monitoring. Consequently, this drives higher demand for image sensor packages to meet stringent automotive reliability requirements. In the past, high reliability image sensor packages are typically with ceramic based packages, these tend to have considerably higher costs and longer development cycles than laminate-based packages which are normally used in high speed, RF or MEMS market segment. Therefore, it is important to ensure a high reliability for the laminate-based packages by studying the package design. This can be done by finite element analysis (FEA) which is a fast and cost-efficient method in analyzing the stress experienced by the package. This paper discusses the effects of different package designs on the package stress using the FEA simulation method. 2023 Conference or Workshop Item PeerReviewed text en http://eprints.utem.edu.my/id/eprint/28008/1/Mechanical%20modelling%20and%20analysis%20of%20CMOS%20image%20sensor%20package.pdf Lim, T.S. and Sukiman, Muhamad Shafiq and Jasmee, Solehah and Masdzarif, Nur Diana Izzani (2023) Mechanical modelling and analysis of CMOS image sensor package. In: 25th Electronics Packaging Technology Conference, EPTC 2023, 5 December 2023through 8 December 2023, Singapore. https://ieeexplore.ieee.org/document/10457582
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description The growth of automotive industry not only focus on power efficiency and carbon emission reduction, it also has makes further progress in the areas of advanced driver assistance systems (ADAS) and autonomous driving (AD) technologies. With the progressive technology breakthrough and heavily studies in these two areas, the demand for imaging cameras is steadily increasing to support applications such as lane detection, traffic sign detection, pedestrian/vehicle recognition and driver monitoring. Consequently, this drives higher demand for image sensor packages to meet stringent automotive reliability requirements. In the past, high reliability image sensor packages are typically with ceramic based packages, these tend to have considerably higher costs and longer development cycles than laminate-based packages which are normally used in high speed, RF or MEMS market segment. Therefore, it is important to ensure a high reliability for the laminate-based packages by studying the package design. This can be done by finite element analysis (FEA) which is a fast and cost-efficient method in analyzing the stress experienced by the package. This paper discusses the effects of different package designs on the package stress using the FEA simulation method.
format Conference or Workshop Item
author Lim, T.S.
Sukiman, Muhamad Shafiq
Jasmee, Solehah
Masdzarif, Nur Diana Izzani
spellingShingle Lim, T.S.
Sukiman, Muhamad Shafiq
Jasmee, Solehah
Masdzarif, Nur Diana Izzani
Mechanical modelling and analysis of CMOS image sensor package
author_facet Lim, T.S.
Sukiman, Muhamad Shafiq
Jasmee, Solehah
Masdzarif, Nur Diana Izzani
author_sort Lim, T.S.
title Mechanical modelling and analysis of CMOS image sensor package
title_short Mechanical modelling and analysis of CMOS image sensor package
title_full Mechanical modelling and analysis of CMOS image sensor package
title_fullStr Mechanical modelling and analysis of CMOS image sensor package
title_full_unstemmed Mechanical modelling and analysis of CMOS image sensor package
title_sort mechanical modelling and analysis of cmos image sensor package
publishDate 2023
url http://eprints.utem.edu.my/id/eprint/28008/1/Mechanical%20modelling%20and%20analysis%20of%20CMOS%20image%20sensor%20package.pdf
http://eprints.utem.edu.my/id/eprint/28008/
https://ieeexplore.ieee.org/document/10457582
_version_ 1814061447492141056
score 13.244109

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