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Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis

Nowadays, demand for the stretchable electronic circuit (SEC) innovative technology is promising in various industries such as biology, advanced robotics, and defense due to their ability to endure enormous amounts of energy and have a wide range of tensile capabilities. However, reliable data regar...

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Main Authors: Zakaria, Mohamad Shukri, Ramli, Mizah, Nordin, Mohd Nur Azmi, Mohd Azli, Daniel Azlan, Shaifuddin, Syahin, Dziaudin, Andee Faeldza, Omar, Ghazali, Lim Abdullah, Abdullah Halim
Format: Article
Language:English
Published: Penerbit Akademia Baru 2023
Online Access:http://eprints.utem.edu.my/id/eprint/27335/2/0196006012024.PDF
http://eprints.utem.edu.my/id/eprint/27335/
https://semarakilmu.com.my/journals/index.php/applied_sciences_eng_tech/article/view/984/1075
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spelling my.utem.eprints.273352024-07-04T10:56:49Z http://eprints.utem.edu.my/id/eprint/27335/ Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis Zakaria, Mohamad Shukri Ramli, Mizah Nordin, Mohd Nur Azmi Mohd Azli, Daniel Azlan Shaifuddin, Syahin Dziaudin, Andee Faeldza Omar, Ghazali Lim Abdullah, Abdullah Halim Nowadays, demand for the stretchable electronic circuit (SEC) innovative technology is promising in various industries such as biology, advanced robotics, and defense due to their ability to endure enormous amounts of energy and have a wide range of tensile capabilities. However, reliable data regarding mechanical characteristics are still sparse due to the percolation nature of the material, which requires its fillers to be connected to one another at all times in order to conduct electricity. To address these issues, the present work opted a finite element analysis (FEA) model that will depict the behaviour of plastic strain on a variety of stretchy conductive ink designs. SEC ink models were created using CAD modeling software and loaded into ANSYS software for finite element analysis (FEA). Behaviors of six different SEC patterns under various longitudinal and lateral stretching conditions were analyzed using the equivalent plastic strain level possessed. Another perspective of the study was to evaluate the impact of expanding the width and thickness of the ink pattern toward the development of the equivalent plastic strain. The result shows that the U-shape SEC pattern had the lowest equivalent plastic strain, with εp= 0.033611 for the longitudinal load and εp= 0.014648 for the lateral load. Penerbit Akademia Baru 2023-02 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/27335/2/0196006012024.PDF Zakaria, Mohamad Shukri and Ramli, Mizah and Nordin, Mohd Nur Azmi and Mohd Azli, Daniel Azlan and Shaifuddin, Syahin and Dziaudin, Andee Faeldza and Omar, Ghazali and Lim Abdullah, Abdullah Halim (2023) Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis. Journal of Advanced Research in Applied Sciences and Engineering Technology, 30 (1). pp. 31-43. ISSN 2462-1943 https://semarakilmu.com.my/journals/index.php/applied_sciences_eng_tech/article/view/984/1075 10.37934/araset.30.1.3143
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Nowadays, demand for the stretchable electronic circuit (SEC) innovative technology is promising in various industries such as biology, advanced robotics, and defense due to their ability to endure enormous amounts of energy and have a wide range of tensile capabilities. However, reliable data regarding mechanical characteristics are still sparse due to the percolation nature of the material, which requires its fillers to be connected to one another at all times in order to conduct electricity. To address these issues, the present work opted a finite element analysis (FEA) model that will depict the behaviour of plastic strain on a variety of stretchy conductive ink designs. SEC ink models were created using CAD modeling software and loaded into ANSYS software for finite element analysis (FEA). Behaviors of six different SEC patterns under various longitudinal and lateral stretching conditions were analyzed using the equivalent plastic strain level possessed. Another perspective of the study was to evaluate the impact of expanding the width and thickness of the ink pattern toward the development of the equivalent plastic strain. The result shows that the U-shape SEC pattern had the lowest equivalent plastic strain, with εp= 0.033611 for the longitudinal load and εp= 0.014648 for the lateral load.
format Article
author Zakaria, Mohamad Shukri
Ramli, Mizah
Nordin, Mohd Nur Azmi
Mohd Azli, Daniel Azlan
Shaifuddin, Syahin
Dziaudin, Andee Faeldza
Omar, Ghazali
Lim Abdullah, Abdullah Halim
spellingShingle Zakaria, Mohamad Shukri
Ramli, Mizah
Nordin, Mohd Nur Azmi
Mohd Azli, Daniel Azlan
Shaifuddin, Syahin
Dziaudin, Andee Faeldza
Omar, Ghazali
Lim Abdullah, Abdullah Halim
Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
author_facet Zakaria, Mohamad Shukri
Ramli, Mizah
Nordin, Mohd Nur Azmi
Mohd Azli, Daniel Azlan
Shaifuddin, Syahin
Dziaudin, Andee Faeldza
Omar, Ghazali
Lim Abdullah, Abdullah Halim
author_sort Zakaria, Mohamad Shukri
title Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
title_short Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
title_full Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
title_fullStr Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
title_full_unstemmed Equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
title_sort equivalent plastic-strain analysis of copper stretchable electronic circuit using finite element analysis
publisher Penerbit Akademia Baru
publishDate 2023
url http://eprints.utem.edu.my/id/eprint/27335/2/0196006012024.PDF
http://eprints.utem.edu.my/id/eprint/27335/
https://semarakilmu.com.my/journals/index.php/applied_sciences_eng_tech/article/view/984/1075
_version_ 1804070312693727232
score 13.211869

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