Elimination of salicide residues in wafer fabrication front-end pre-metal layer cleaning process
Wafer fabrication for integrated circuit is one of the most complicated process in semiconductor manufacturing industry. High yield is always the ultimate goal to achieve hence a good defect management is the key to ensure the goal is met. Salicide residue is a major defect in SilTerra wet etching p...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2022
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/26942/1/Elimination%20of%20salicide%20residues%20in%20wafer%20fabrication%20front-end%20pre-metal%20layer%20cleaning%20process.pdf http://eprints.utem.edu.my/id/eprint/26942/2/Elimination%20of%20salicide%20residues%20in%20wafer%20fabrication%20front-end%20pre-metal%20layer%20cleaning%20process.pdf http://eprints.utem.edu.my/id/eprint/26942/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122165 |
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http://eprints.utem.edu.my/id/eprint/26942/1/Elimination%20of%20salicide%20residues%20in%20wafer%20fabrication%20front-end%20pre-metal%20layer%20cleaning%20process.pdfhttp://eprints.utem.edu.my/id/eprint/26942/2/Elimination%20of%20salicide%20residues%20in%20wafer%20fabrication%20front-end%20pre-metal%20layer%20cleaning%20process.pdf
http://eprints.utem.edu.my/id/eprint/26942/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122165