Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys
Within electronics industry, flexible printed circuits (FPC) are compiled in stacks to achieve smaller sizes and higher component density. The architecture size of a computer processor has been shrunk from 10 µm to 7 nm from year 1971 to 2020. In order to meet the market expectation, manufacturers h...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2021
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/26053/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121228 |
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http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdfhttp://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf
http://eprints.utem.edu.my/id/eprint/26053/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121228