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Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...

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Main Author: Liou, Jacqueline Jing Wen
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
http://eprints.utem.edu.my/id/eprint/25573/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122
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spelling my.utem.eprints.255732022-01-06T14:09:41Z http://eprints.utem.edu.my/id/eprint/25573/ Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process Liou, Jacqueline Jing Wen T Technology (General) TJ Mechanical engineering and machinery Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon device bonded on top of a thin glass chip. Other than that, both of the chip is mounted on DAF tape for a cheaper assembly solution. There are no experience in Infineon to process glass wafer mounted on DAF dicing tape which is a key challenges in this project. Hence, the purpose of this study was to create a solution in die separation of glass wafer. Therefore, it is crucial that process characterisation of glass wafer dicing by using mechanical dicing method. This project is defined to comply with automotive specifications especially on dicing induced quality risk such as top side chipping, side wall chipping, back side chipping and other defects. Research and philosophy on glass wafer dicing method is harvested and referred as past experience learning. Design of experiments is developed based on the critical parameters in mechanical dicing. Then, the result will based on design model method by using Minitab software. With the help of response surface methodology, optimized parameters has been selected. The outcome of this project is glass wafer dicing are able to finalized by using mechanical dicing method with the optmized parameters. Out of 11 DOEs, DOE 7 has been selected as the best solution and repeatability run has shown positive results. However, blade life study is recommended to perform as the blade used are new resin blade. 2020 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf text en http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf Liou, Jacqueline Jing Wen (2020) Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Liou, Jacqueline Jing Wen
Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
description Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon device bonded on top of a thin glass chip. Other than that, both of the chip is mounted on DAF tape for a cheaper assembly solution. There are no experience in Infineon to process glass wafer mounted on DAF dicing tape which is a key challenges in this project. Hence, the purpose of this study was to create a solution in die separation of glass wafer. Therefore, it is crucial that process characterisation of glass wafer dicing by using mechanical dicing method. This project is defined to comply with automotive specifications especially on dicing induced quality risk such as top side chipping, side wall chipping, back side chipping and other defects. Research and philosophy on glass wafer dicing method is harvested and referred as past experience learning. Design of experiments is developed based on the critical parameters in mechanical dicing. Then, the result will based on design model method by using Minitab software. With the help of response surface methodology, optimized parameters has been selected. The outcome of this project is glass wafer dicing are able to finalized by using mechanical dicing method with the optmized parameters. Out of 11 DOEs, DOE 7 has been selected as the best solution and repeatability run has shown positive results. However, blade life study is recommended to perform as the blade used are new resin blade.
format Thesis
author Liou, Jacqueline Jing Wen
author_facet Liou, Jacqueline Jing Wen
author_sort Liou, Jacqueline Jing Wen
title Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_short Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_full Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_fullStr Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_full_unstemmed Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_sort experimental investigation of mechanical dicing parameters on the quality of thin glass wafer cutting process
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
http://eprints.utem.edu.my/id/eprint/25573/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122
_version_ 1724077903017148416
score 13.211869

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