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An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly

Combining the flexibility and stretchability of printed flexible circuits (PFC) such as PET and TPU with water repellent characteristics may improve the functionality of printed circuit for electronic packaging. Water repellent characteristics using ceramic-based coating may protect the surface from...

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Main Authors: Omar, Ghazali, Samsudin, Zambri, Nordin, Mohd Nur Azmi, Kamarolzaman, Anita Akmar, Masripan, Nor Azmmi, Salim, Mohd Azli, Mansor, Muhd Ridzuan, Wu, Jonathan Wei Ping
Format: Technical Report
Language:English
Published: UTeM 2019
Online Access:http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25485/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484
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spelling my.utem.eprints.254852022-01-04T12:39:51Z http://eprints.utem.edu.my/id/eprint/25485/ An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly Omar, Ghazali Samsudin, Zambri Nordin, Mohd Nur Azmi Kamarolzaman, Anita Akmar Masripan, Nor Azmmi Salim, Mohd Azli Mansor, Muhd Ridzuan Wu, Jonathan Wei Ping Combining the flexibility and stretchability of printed flexible circuits (PFC) such as PET and TPU with water repellent characteristics may improve the functionality of printed circuit for electronic packaging. Water repellent characteristics using ceramic-based coating may protect the surface from degradation and moisture absorption due to the hydrophobicity behavior of the surface after coating.This research seeks to provide insight into characterization and understanding on the effect of thermal on the hydrophobic performance of polymer substrate (PET and TPU) with and without coated with a ceramic coating which is Titanium Dioxide (TiO2) for more robust and vigorous hydrophobiccoating. The annealing temperature was determined by using DSC analysis and four different temperatures have been used in this study. Contact angle and surface roughness characterization were evaluated by self-fabricate contact angle measurement tools and Mitutoyo Profilometer Surftest SJ410. The results reveal that hydrophobicity of uncoated TPU increase and PET decrease after thermally aged. However, after coated with TiO2, both substrate shows further increment in hydrophobicity with contact angle more than 90°. The 2D profile reveals that surface roughness protrusion becomes one of the factors affecting the hydrophobicity of the surface due to liquid-air interfaces under the droplet (air trap) as stated in Wenzel and CassieBaxter theory. UTeM 2019 Technical Report NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf Omar, Ghazali and Samsudin, Zambri and Nordin, Mohd Nur Azmi and Kamarolzaman, Anita Akmar and Masripan, Nor Azmmi and Salim, Mohd Azli and Mansor, Muhd Ridzuan and Wu, Jonathan Wei Ping (2019) An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly. [Technical Report] (Submitted) https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484 CDR 21417
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Combining the flexibility and stretchability of printed flexible circuits (PFC) such as PET and TPU with water repellent characteristics may improve the functionality of printed circuit for electronic packaging. Water repellent characteristics using ceramic-based coating may protect the surface from degradation and moisture absorption due to the hydrophobicity behavior of the surface after coating.This research seeks to provide insight into characterization and understanding on the effect of thermal on the hydrophobic performance of polymer substrate (PET and TPU) with and without coated with a ceramic coating which is Titanium Dioxide (TiO2) for more robust and vigorous hydrophobiccoating. The annealing temperature was determined by using DSC analysis and four different temperatures have been used in this study. Contact angle and surface roughness characterization were evaluated by self-fabricate contact angle measurement tools and Mitutoyo Profilometer Surftest SJ410. The results reveal that hydrophobicity of uncoated TPU increase and PET decrease after thermally aged. However, after coated with TiO2, both substrate shows further increment in hydrophobicity with contact angle more than 90°. The 2D profile reveals that surface roughness protrusion becomes one of the factors affecting the hydrophobicity of the surface due to liquid-air interfaces under the droplet (air trap) as stated in Wenzel and CassieBaxter theory.
format Technical Report
author Omar, Ghazali
Samsudin, Zambri
Nordin, Mohd Nur Azmi
Kamarolzaman, Anita Akmar
Masripan, Nor Azmmi
Salim, Mohd Azli
Mansor, Muhd Ridzuan
Wu, Jonathan Wei Ping
spellingShingle Omar, Ghazali
Samsudin, Zambri
Nordin, Mohd Nur Azmi
Kamarolzaman, Anita Akmar
Masripan, Nor Azmmi
Salim, Mohd Azli
Mansor, Muhd Ridzuan
Wu, Jonathan Wei Ping
An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
author_facet Omar, Ghazali
Samsudin, Zambri
Nordin, Mohd Nur Azmi
Kamarolzaman, Anita Akmar
Masripan, Nor Azmmi
Salim, Mohd Azli
Mansor, Muhd Ridzuan
Wu, Jonathan Wei Ping
author_sort Omar, Ghazali
title An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
title_short An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
title_full An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
title_fullStr An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
title_full_unstemmed An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly
title_sort investigation of superhydrophobic waterproofing for electronic assembly
publisher UTeM
publishDate 2019
url http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25485/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484
_version_ 1724077896666972160
score 13.211869

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