Interface Thermal Resistance And Thermal Conductivity Of Polymer Composites At Different Types, Shapes, And Sizes Of Fillers: A Review
The growing demand toward miniaturization and power device packaging required new die-attach materials with high thermal conductivity (TC). Multitudinous attention is being paid to enhance the TC of thermally conductive polymer composites as it is easy to fabricate and environmentally friendly and h...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley Online Library
2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25372/2/REVIEW%20PAPER%20SOLEHAH-COMPRESSED.PDF http://eprints.utem.edu.my/id/eprint/25372/ https://onlinelibrary.wiley.com/doi/10.1002/pc.26029 https://doi.org/10.1002/pc.26029 |
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