Mode stresses for a thermally insulated curve crack in bonded two half planes
Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement,...
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| 主要な著者: | , , , |
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| フォーマット: | 論文 |
| 言語: | English |
| 出版事項: |
Malaysian Journal Management System
2020
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| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF http://eprints.utem.edu.my/id/eprint/25295/ http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758 |
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