Mode stresses for a thermally insulated curve crack in bonded two half planes
Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement,...
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| Main Authors: | , , , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
Malaysian Journal Management System
2020
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| 在線閱讀: | http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF http://eprints.utem.edu.my/id/eprint/25295/ http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758 |
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| 總結: | Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement, resultant force and heat conduction functions. This new HSIEs is solve numerically by using curve length coordinate function and quadrature formulas for the unknown crack opening displacement (COD) function and the right hand side is the traction along the crack. The obtained COD function is then used to compute the stress intensity factors (SIF) in order to analyze the stability behavior of the materials containing cracks or flaws. Numerical results presented the behavior of nondimensional SIF at tips subjected to four mode stresses such as Mode I (Normal), Mode II (Shear), Mode III (Tearing) and Mix Mode stresses. |
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