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Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology

Copper filling is a method for 3D stacked packaging and has been widely used in the semiconductor industry. However, as the downsizing of devices becomes an unavoidable trend, the tolerance of flexible printed circuit (FPC) fabrication has to decrease, resulting in high failure rates. To solve this...

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Main Authors: Liew, Pay Jun, Wong, Kah Yan, Lau, Kok Tee, Jingsi, Wang
Format: Article
Language:English
Published: Penerbit UTeM 2020
Online Access:http://eprints.utem.edu.my/id/eprint/25234/2/FINAL%20COPY-COMPRESSED%20%281%29.PDF
http://eprints.utem.edu.my/id/eprint/25234/
https://jamt.utem.edu.my/jamt/article/view/5935/3898
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spelling my.utem.eprints.252342021-07-28T12:34:28Z http://eprints.utem.edu.my/id/eprint/25234/ Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology Liew, Pay Jun Wong, Kah Yan Lau, Kok Tee Jingsi, Wang Copper filling is a method for 3D stacked packaging and has been widely used in the semiconductor industry. However, as the downsizing of devices becomes an unavoidable trend, the tolerance of flexible printed circuit (FPC) fabrication has to decrease, resulting in high failure rates. To solve this problem, optimal process variables for copper filling must be studied to avoid the risk of failure. In this study, the effects of copper via filling parameters (current density (Id), fluid flow rate (Q) and filling time (tf)) on the filling behavior of a micro via (surface thickness, dimple depth and viafilling ratio) were investigated. The via on the FPC board was drilled using a laser drill with a dimension of 100 µm. Then, the FPC was immersed in an electrolyte for the copper via filling process. Experimental results showed that current density was significant to surface thickness, whereas fluid flow rate was significant to the dimple depth and via filling ratio. The optimum parameters to achieve thin surface thickness, low dimple depth and high via filling ratio were found to be at 1.5 A/dm2 of current density, 35 m3 /h of fluid flow rate and 60 min of filling time Penerbit UTeM 2020-08 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25234/2/FINAL%20COPY-COMPRESSED%20%281%29.PDF Liew, Pay Jun and Wong, Kah Yan and Lau, Kok Tee and Jingsi, Wang (2020) Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology. Journal of Advanced Manufacturing Technology (JAMT), 14 (2). pp. 1-14. ISSN 1985-3157 https://jamt.utem.edu.my/jamt/article/view/5935/3898
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Copper filling is a method for 3D stacked packaging and has been widely used in the semiconductor industry. However, as the downsizing of devices becomes an unavoidable trend, the tolerance of flexible printed circuit (FPC) fabrication has to decrease, resulting in high failure rates. To solve this problem, optimal process variables for copper filling must be studied to avoid the risk of failure. In this study, the effects of copper via filling parameters (current density (Id), fluid flow rate (Q) and filling time (tf)) on the filling behavior of a micro via (surface thickness, dimple depth and viafilling ratio) were investigated. The via on the FPC board was drilled using a laser drill with a dimension of 100 µm. Then, the FPC was immersed in an electrolyte for the copper via filling process. Experimental results showed that current density was significant to surface thickness, whereas fluid flow rate was significant to the dimple depth and via filling ratio. The optimum parameters to achieve thin surface thickness, low dimple depth and high via filling ratio were found to be at 1.5 A/dm2 of current density, 35 m3 /h of fluid flow rate and 60 min of filling time
format Article
author Liew, Pay Jun
Wong, Kah Yan
Lau, Kok Tee
Jingsi, Wang
spellingShingle Liew, Pay Jun
Wong, Kah Yan
Lau, Kok Tee
Jingsi, Wang
Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
author_facet Liew, Pay Jun
Wong, Kah Yan
Lau, Kok Tee
Jingsi, Wang
author_sort Liew, Pay Jun
title Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
title_short Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
title_full Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
title_fullStr Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
title_full_unstemmed Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
title_sort optimization of copper via filling process for flexible printed circuit using response surface methodology
publisher Penerbit UTeM
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25234/2/FINAL%20COPY-COMPRESSED%20%281%29.PDF
http://eprints.utem.edu.my/id/eprint/25234/
https://jamt.utem.edu.my/jamt/article/view/5935/3898
_version_ 1706960989651468288
score 13.211869

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