Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using
Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2019
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=117932 |
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http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdfhttp://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf
http://eprints.utem.edu.my/id/eprint/24952/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=117932