Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate
Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful development of such materials are to offer high electrical conductivity and g...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Perlis
2020
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| Online Access: | http://eprints.utem.edu.my/id/eprint/24864/2/VOL_13_SI_MEI2020_419-430.PDF http://eprints.utem.edu.my/id/eprint/24864/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM%20SPECIAL%20ISSUE%20MEI%202020/Vol_13_SI_Mei2020_419-430.pdf |
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