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Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method

The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...

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Main Authors: Ab Majid, Nurul Kausar, Ismail, Fatimah Sham
Format: Article
Language:English
Published: Universitas Ahmad Dahlan 2019
Online Access:http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF
http://eprints.utem.edu.my/id/eprint/24279/
http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749
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spelling my.utem.eprints.242792020-08-04T12:45:07Z http://eprints.utem.edu.my/id/eprint/24279/ Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method Ab Majid, Nurul Kausar Ismail, Fatimah Sham The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system. This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system. Universitas Ahmad Dahlan 2019-10 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF Ab Majid, Nurul Kausar and Ismail, Fatimah Sham (2019) Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method. Telkomnika (Telecommunication Computing Electronics and Control), 17 (5). pp. 2268-2275. ISSN 2302-9293 (In Press) http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749 10.12928/TELKOMNIKA.v17i5.12796
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system. This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system.
format Article
author Ab Majid, Nurul Kausar
Ismail, Fatimah Sham
spellingShingle Ab Majid, Nurul Kausar
Ismail, Fatimah Sham
Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
author_facet Ab Majid, Nurul Kausar
Ismail, Fatimah Sham
author_sort Ab Majid, Nurul Kausar
title Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
title_short Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
title_full Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
title_fullStr Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
title_full_unstemmed Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
title_sort electronics system thermal management optimization using finite element and nelder-mead method
publisher Universitas Ahmad Dahlan
publishDate 2019
url http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF
http://eprints.utem.edu.my/id/eprint/24279/
http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749
_version_ 1675330921582034944
score 13.211869

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