Process Parameter Optimization Of Adhesive Dispense Machine
Adhesive dispense applications that discussed in this study relate to the process parameter optimization of adhesive dispense machine for Surface Mount Technology (SMT) Applications. SMT Adhesive dispensing process is the process of transferring adhesive onto the PCB solder mask in a position suitab...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English English |
| Published: |
2018
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/23962/1/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdf http://eprints.utem.edu.my/id/eprint/23962/2/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdf http://eprints.utem.edu.my/id/eprint/23962/ http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114812 |
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http://eprints.utem.edu.my/id/eprint/23962/1/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdfhttp://eprints.utem.edu.my/id/eprint/23962/2/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdf
http://eprints.utem.edu.my/id/eprint/23962/
http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114812