Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase o...
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| Main Authors: | , , , , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
Elsevier Ltd.
2017
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| 在線閱讀: | http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf http://eprints.utem.edu.my/id/eprint/22722/ https://www.sciencedirect.com/science/article/pii/S0026271417304870 |
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