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Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering

Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase o...

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Main Authors: Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi
Format: Article
Language:English
Published: Elsevier Ltd. 2017
Online Access:http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf
http://eprints.utem.edu.my/id/eprint/22722/
https://www.sciencedirect.com/science/article/pii/S0026271417304870
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spelling my.utem.eprints.227222021-08-22T16:48:00Z http://eprints.utem.edu.my/id/eprint/22722/ Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering Abdullah, Mohd Zulkifly Ali Mokhtar, Mohd Najib Saad, Abdullah Aziz Samsudin, Zambri Che Ani, Fakhrozi Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase on board. User-defined function with c-code was integrated into the model, Volume of Fluid (VOF) method was applied to the melt front tracking, and solidification model was used for the phase change solder material. The material used in the study was SAC 105, SAC 305 and SAC 405. The specific heat, latent heat, solidus temperature, liquidus temperature of the lead-free solder and geometrical data for model input was determined experimentally. The model was validated experimentally. The self-alignment capability of different lead-free solder was presented. It has been observed that higher silver content solder (SAC 405) have higher self-alignment capability during reflow soldering compare to SAC 305 and SAC 105. Moreover, all cases show self-alignment in perpendicular to the longer sides of chip resistor travelled more towards the central position. The experimental and simulation results are in good conformity and can be extended for different cases. Elsevier Ltd. 2017 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf Abdullah, Mohd Zulkifly and Ali Mokhtar, Mohd Najib and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714 https://www.sciencedirect.com/science/article/pii/S0026271417304870 10.1016/j.microrel.2017.10.011
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase on board. User-defined function with c-code was integrated into the model, Volume of Fluid (VOF) method was applied to the melt front tracking, and solidification model was used for the phase change solder material. The material used in the study was SAC 105, SAC 305 and SAC 405. The specific heat, latent heat, solidus temperature, liquidus temperature of the lead-free solder and geometrical data for model input was determined experimentally. The model was validated experimentally. The self-alignment capability of different lead-free solder was presented. It has been observed that higher silver content solder (SAC 405) have higher self-alignment capability during reflow soldering compare to SAC 305 and SAC 105. Moreover, all cases show self-alignment in perpendicular to the longer sides of chip resistor travelled more towards the central position. The experimental and simulation results are in good conformity and can be extended for different cases.
format Article
author Abdullah, Mohd Zulkifly
Ali Mokhtar, Mohd Najib
Saad, Abdullah Aziz
Samsudin, Zambri
Che Ani, Fakhrozi
spellingShingle Abdullah, Mohd Zulkifly
Ali Mokhtar, Mohd Najib
Saad, Abdullah Aziz
Samsudin, Zambri
Che Ani, Fakhrozi
Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
author_facet Abdullah, Mohd Zulkifly
Ali Mokhtar, Mohd Najib
Saad, Abdullah Aziz
Samsudin, Zambri
Che Ani, Fakhrozi
author_sort Abdullah, Mohd Zulkifly
title Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
title_short Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
title_full Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
title_fullStr Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
title_full_unstemmed Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
title_sort numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
publisher Elsevier Ltd.
publishDate 2017
url http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf
http://eprints.utem.edu.my/id/eprint/22722/
https://www.sciencedirect.com/science/article/pii/S0026271417304870
_version_ 1709671900964192256
score 13.223943

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