Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering
Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase o...
保存先:
| 主要な著者: | , , , , |
|---|---|
| フォーマット: | 論文 |
| 言語: | English |
| 出版事項: |
Elsevier Ltd.
2017
|
| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf http://eprints.utem.edu.my/id/eprint/22722/ https://www.sciencedirect.com/science/article/pii/S0026271417304870 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|