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Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface

Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to...

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Main Author: Yeo, Kian Hong
Format: Thesis
Language:English
English
Published: 2016
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf
http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf
http://eprints.utem.edu.my/id/eprint/21028/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104946
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spelling my.utem.eprints.210282022-12-16T16:53:25Z http://eprints.utem.edu.my/id/eprint/21028/ Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface Yeo, Kian Hong T Technology (General) TK Electrical engineering. Electronics Nuclear engineering Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to eliminate defects related to the die attach process. Epoxy glue void formation at the chip/substrate interface happens when multi nozzle shower is used for the glue distribution as an adhesive layer. The epoxy unable to flow uniformly, thus air is trapped in the epoxy layer at the chip/substrate interface. The current study investigates the effect of the shower head nozzles' separation (wall space) on the epoxy void formation and die shear strength. It was found that the nozzle separation has a significant and positive correlation on the void formation, but not on the shear strength of the die attach chip/substrate interface. Thus, it is recommended that the nozzles' separation (wall space) dimension to be increased by reducing quantity of nozzle used in order to reduce the void percentage to be equal or less than five percent. 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf text en http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf Yeo, Kian Hong (2016) Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104946
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
spellingShingle T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Yeo, Kian Hong
Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
description Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to eliminate defects related to the die attach process. Epoxy glue void formation at the chip/substrate interface happens when multi nozzle shower is used for the glue distribution as an adhesive layer. The epoxy unable to flow uniformly, thus air is trapped in the epoxy layer at the chip/substrate interface. The current study investigates the effect of the shower head nozzles' separation (wall space) on the epoxy void formation and die shear strength. It was found that the nozzle separation has a significant and positive correlation on the void formation, but not on the shear strength of the die attach chip/substrate interface. Thus, it is recommended that the nozzles' separation (wall space) dimension to be increased by reducing quantity of nozzle used in order to reduce the void percentage to be equal or less than five percent.
format Thesis
author Yeo, Kian Hong
author_facet Yeo, Kian Hong
author_sort Yeo, Kian Hong
title Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
title_short Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
title_full Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
title_fullStr Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
title_full_unstemmed Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
title_sort effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf
http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf
http://eprints.utem.edu.my/id/eprint/21028/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104946
_version_ 1753792477561618432
score 13.211869

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