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Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS

This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic invol...

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Main Author: Heng, Soo Ann
Format: Thesis
Language:English
English
Published: 2016
Subjects:
T Technology (General)
TP Chemical technology
Online Access:http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
http://eprints.utem.edu.my/id/eprint/20941/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922
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spelling my.utem.eprints.209412022-11-07T11:20:02Z http://eprints.utem.edu.my/id/eprint/20941/ Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS Heng, Soo Ann T Technology (General) TP Chemical technology This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic involved in this project will be the introduction which includes problem statement that contributes to the start of project where the need of reducing schedule downtime in molding process is included. It is then followed by literature review where work of others are reviewed so that the no repetition on work done is available and to study on the method of implementation done by others in the similar field. This project will also discuss about the method used in the detail analysis in the project so that waste on downtime can be achieved. Upon result of analysis is available, various improvement actions will be suggested accordingly. By implementation of the improvement actions in the production, the result of the implementation will be monitored according to the implementation date. The objective of performing improvement in schedule downtime reduction for Molding process of integrated circuits package DPAK STS in Infineon Technologies (M) Sdn Bhd will be monitored in the result & discussion section. 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf text en http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf Heng, Soo Ann (2016) Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TP Chemical technology
spellingShingle T Technology (General)
TP Chemical technology
Heng, Soo Ann
Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
description This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic involved in this project will be the introduction which includes problem statement that contributes to the start of project where the need of reducing schedule downtime in molding process is included. It is then followed by literature review where work of others are reviewed so that the no repetition on work done is available and to study on the method of implementation done by others in the similar field. This project will also discuss about the method used in the detail analysis in the project so that waste on downtime can be achieved. Upon result of analysis is available, various improvement actions will be suggested accordingly. By implementation of the improvement actions in the production, the result of the implementation will be monitored according to the implementation date. The objective of performing improvement in schedule downtime reduction for Molding process of integrated circuits package DPAK STS in Infineon Technologies (M) Sdn Bhd will be monitored in the result & discussion section.
format Thesis
author Heng, Soo Ann
author_facet Heng, Soo Ann
author_sort Heng, Soo Ann
title Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_short Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_full Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_fullStr Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_full_unstemmed Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_sort improvement of molding process scheduled downtime reduction for integrated circuits package dpak sts
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
http://eprints.utem.edu.my/id/eprint/20941/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922
_version_ 1751540443280048128
score 13.211869

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