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Molding temperature control enhancement for transfer molding process via additional wire heater

In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their require...

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Main Author: Zainal, Mohd Syafiq
Format: Thesis
Language:English
English
Published: 2016
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
http://eprints.utem.edu.my/id/eprint/20455/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104964
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spelling my.utem.eprints.204552022-10-25T16:09:46Z http://eprints.utem.edu.my/id/eprint/20455/ Molding temperature control enhancement for transfer molding process via additional wire heater Zainal, Mohd Syafiq T Technology (General) TJ Mechanical engineering and machinery In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their requirement. However to control the molding temperature is not an easy task as during molding process mold chase temperature cycle kept continuously fluctuating due to heat loss by surrounding throughout molding process. Thus a good mold chase temperature controller is a big advantage in order to obtain a quality molded product. However the Low Stress Mold Compound (LSMC) type mold compound has a very small temperature operating window by referring from the viscosity curve versus molding temperature. The optimum mold temperature for this mold compound is at 190± 3°C.Current molding machine mold chase temperature control capability is at ±5°C,therefore a new innovation method is needed on current molding machine to overcome this issue by introducing the additional wire heater near to the mold cavity surface to have better control of the mold chase temperature. With this innovation, the mold chase temperature is controlled at ± l.5°C which complies with the operating window of LSMC mold compound .By doing this, losses due to the temperature instability during molding process are reduced significantly. 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf text en http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf Zainal, Mohd Syafiq (2016) Molding temperature control enhancement for transfer molding process via additional wire heater. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104964
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Zainal, Mohd Syafiq
Molding temperature control enhancement for transfer molding process via additional wire heater
description In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their requirement. However to control the molding temperature is not an easy task as during molding process mold chase temperature cycle kept continuously fluctuating due to heat loss by surrounding throughout molding process. Thus a good mold chase temperature controller is a big advantage in order to obtain a quality molded product. However the Low Stress Mold Compound (LSMC) type mold compound has a very small temperature operating window by referring from the viscosity curve versus molding temperature. The optimum mold temperature for this mold compound is at 190± 3°C.Current molding machine mold chase temperature control capability is at ±5°C,therefore a new innovation method is needed on current molding machine to overcome this issue by introducing the additional wire heater near to the mold cavity surface to have better control of the mold chase temperature. With this innovation, the mold chase temperature is controlled at ± l.5°C which complies with the operating window of LSMC mold compound .By doing this, losses due to the temperature instability during molding process are reduced significantly.
format Thesis
author Zainal, Mohd Syafiq
author_facet Zainal, Mohd Syafiq
author_sort Zainal, Mohd Syafiq
title Molding temperature control enhancement for transfer molding process via additional wire heater
title_short Molding temperature control enhancement for transfer molding process via additional wire heater
title_full Molding temperature control enhancement for transfer molding process via additional wire heater
title_fullStr Molding temperature control enhancement for transfer molding process via additional wire heater
title_full_unstemmed Molding temperature control enhancement for transfer molding process via additional wire heater
title_sort molding temperature control enhancement for transfer molding process via additional wire heater
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
http://eprints.utem.edu.my/id/eprint/20455/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104964
_version_ 1748184297352724480
score 13.211869

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