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Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance

In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is des...

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Main Authors: Tai, Min Fee, Lee, Swee Kah, Goh, Soon Lock, Kok, Swee Leong, Kenichiroh, Mukai, Tafadwa, Magaya
Format: Conference or Workshop Item
Language:English
Published: 2014
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf
http://eprints.utem.edu.my/id/eprint/14856/
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1
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spelling my.utem.eprints.148562015-09-29T03:37:27Z http://eprints.utem.edu.my/id/eprint/14856/ Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance Tai, Min Fee Lee, Swee Kah Goh, Soon Lock Kok, Swee Leong Kenichiroh, Mukai Tafadwa, Magaya TK Electrical engineering. Electronics Nuclear engineering In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is desirable. Conventional metal plating techniques, however fail tape test. This paper studies the condition of plating metal directly onto surface of mold compound with the enhancement of novel non-etching adhesion promoter CovaBond MRTM. By plating direct onto mold compound, the shielding capping task can be done in array form before the die saw process in IC manufacturing (before IC assembly), which reduce the thickness and dimension of chip and improves design flexibility of circuit board as well as reduce the manufacturing cost. The industrial test results in this paper have proven the performance of the enhanced metal plating technique. 2014 Conference or Workshop Item PeerReviewed text en http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf Tai, Min Fee and Lee, Swee Kah and Goh, Soon Lock and Kok, Swee Leong and Kenichiroh, Mukai and Tafadwa, Magaya (2014) Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance. In: IEEE International Conference on Semiconductor Electronics (ICSE), , 27-29 Aug. 2014, Kuala Lumpur. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Tai, Min Fee
Lee, Swee Kah
Goh, Soon Lock
Kok, Swee Leong
Kenichiroh, Mukai
Tafadwa, Magaya
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
description In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is desirable. Conventional metal plating techniques, however fail tape test. This paper studies the condition of plating metal directly onto surface of mold compound with the enhancement of novel non-etching adhesion promoter CovaBond MRTM. By plating direct onto mold compound, the shielding capping task can be done in array form before the die saw process in IC manufacturing (before IC assembly), which reduce the thickness and dimension of chip and improves design flexibility of circuit board as well as reduce the manufacturing cost. The industrial test results in this paper have proven the performance of the enhanced metal plating technique.
format Conference or Workshop Item
author Tai, Min Fee
Lee, Swee Kah
Goh, Soon Lock
Kok, Swee Leong
Kenichiroh, Mukai
Tafadwa, Magaya
author_facet Tai, Min Fee
Lee, Swee Kah
Goh, Soon Lock
Kok, Swee Leong
Kenichiroh, Mukai
Tafadwa, Magaya
author_sort Tai, Min Fee
title Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
title_short Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
title_full Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
title_fullStr Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
title_full_unstemmed Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
title_sort adhesion enhancement for electroless plating on mold compound for emi shielding with industrial test compliance
publishDate 2014
url http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf
http://eprints.utem.edu.my/id/eprint/14856/
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1
_version_ 1665905615709405184
score 13.211869

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