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FEA MEMS Packaging For Sensor

Mechanical characteristics of a sensor microbeam based on resonance frequency for gas detection and their dependence on the geometry and materials is investigated in this paper. These microbeam structures will be modeled in Finite Element Analysis software (ANSYS 7.0). The microbeam structu...

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Main Author: Abdullah@Muhamad, Maswandy
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2005
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/58170/1/Fea%20MEMS%20Packaging%20For%20Sensor_Maswandy%20Abdullah%40Muhamad.pdf
http://eprints.usm.my/58170/
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spelling my.usm.eprints.58170 http://eprints.usm.my/58170/ FEA MEMS Packaging For Sensor Abdullah@Muhamad, Maswandy T Technology TJ Mechanical engineering and machinery Mechanical characteristics of a sensor microbeam based on resonance frequency for gas detection and their dependence on the geometry and materials is investigated in this paper. These microbeam structures will be modeled in Finite Element Analysis software (ANSYS 7.0). The microbeam structures investigated in this work are formed from six microcantilevers and a microbridge design. Each of the microcantilevers has differences in their dimensions. While the microbridge will be analyzed in different materials. All of six microcantilevers also will be analyzed in these different materials to define the best result. Each of these structures has a specific resonance frequency, which varies as a function device shape, structure mass and the physical properties of its component materials. The microbeam structures are then will be simulating in ANSYS 7.0 software to measure its resonance frequencies value. Parametric studies for the microcantilever also will be investigated. Preliminary results shows the shorter microcantilever have higher resonance frequency than the longer ones using polysilicon material, and silicon nitride material give the higher resonance frequency modes for microbeam structure design than other materials. These results will be verified with experimental result in journal. The packaging technique also will be applied to this sensor depends on its requirements and applications. This packaging technique will be discussed roughly in this paper. Universiti Sains Malaysia 2005-03-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/58170/1/Fea%20MEMS%20Packaging%20For%20Sensor_Maswandy%20Abdullah%40Muhamad.pdf Abdullah@Muhamad, Maswandy (2005) FEA MEMS Packaging For Sensor. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TJ Mechanical engineering and machinery
spellingShingle T Technology
TJ Mechanical engineering and machinery
Abdullah@Muhamad, Maswandy
FEA MEMS Packaging For Sensor
description Mechanical characteristics of a sensor microbeam based on resonance frequency for gas detection and their dependence on the geometry and materials is investigated in this paper. These microbeam structures will be modeled in Finite Element Analysis software (ANSYS 7.0). The microbeam structures investigated in this work are formed from six microcantilevers and a microbridge design. Each of the microcantilevers has differences in their dimensions. While the microbridge will be analyzed in different materials. All of six microcantilevers also will be analyzed in these different materials to define the best result. Each of these structures has a specific resonance frequency, which varies as a function device shape, structure mass and the physical properties of its component materials. The microbeam structures are then will be simulating in ANSYS 7.0 software to measure its resonance frequencies value. Parametric studies for the microcantilever also will be investigated. Preliminary results shows the shorter microcantilever have higher resonance frequency than the longer ones using polysilicon material, and silicon nitride material give the higher resonance frequency modes for microbeam structure design than other materials. These results will be verified with experimental result in journal. The packaging technique also will be applied to this sensor depends on its requirements and applications. This packaging technique will be discussed roughly in this paper.
format Monograph
author Abdullah@Muhamad, Maswandy
author_facet Abdullah@Muhamad, Maswandy
author_sort Abdullah@Muhamad, Maswandy
title FEA MEMS Packaging For Sensor
title_short FEA MEMS Packaging For Sensor
title_full FEA MEMS Packaging For Sensor
title_fullStr FEA MEMS Packaging For Sensor
title_full_unstemmed FEA MEMS Packaging For Sensor
title_sort fea mems packaging for sensor
publisher Universiti Sains Malaysia
publishDate 2005
url http://eprints.usm.my/58170/1/Fea%20MEMS%20Packaging%20For%20Sensor_Maswandy%20Abdullah%40Muhamad.pdf
http://eprints.usm.my/58170/
_version_ 1765297656822759424
score 13.211869

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