Electrodeposition Of Copper On Stainless Steel For Solid Oxide Fuel Cell Interconnect Application
SS 304 stainless steel is potential candidate as solid oxide fuel cell interconnector since it has appropriate chromium content to increase corrosion resistant and is less expensive. However, formation of chromium oxide scale at elevated temperature and low electrical conductivity needed to be sol...
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Main Author: | |
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Format: | Monograph |
Language: | English |
Published: |
Universiti Sains Malaysia
2022
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Subjects: | |
Online Access: | http://eprints.usm.my/56682/1/Electrodeposition%20Of%20Copper%20On%20Stainless%20Steel%20For%20Solid%20Oxide%20Fuel%20Cell%20Interconnect%20Application_Tan%20Hong%20Liang.pdf http://eprints.usm.my/56682/ |
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Summary: | SS 304 stainless steel is potential candidate as solid oxide fuel cell interconnector since it has appropriate chromium content to increase corrosion resistant and is less
expensive. However, formation of chromium oxide scale at elevated temperature and low electrical conductivity needed to be solved to improve interconnect performances. Cu
coating layer was electrodeposited on SS304 stainless steel using electrodeposition with alkaline copper sulphate solution consisted of EDTA solution. Electrodeposition time of
Cu coating (60s, 180s, 300s and 600s), the morphology of the coating and oxidation mechanisms were investigated by using scanning electron microscopy and X-ray diffraction analysis. From the formation parameter due to electrodeposition time for the coating, it was found that deposition time plays significant roles in coating behavior. The copper with 600s results in thicker and larger grain size with uniform coating.
Furthermore, the stainless steel with coating layer was analysed after 30 hours for surface roughness, static water contact angle (WCA), oxidation and four-point test. Cyclic
oxidation test was applied to evaluate the oxidation resistance of the coating layer. In this study, the coated SS 304 which showed lower ASR (7.78 mΩ·cm2) compared to uncoated
SS 304 (38.87 mΩ·cm2) and no spallation is the most reliable candidate to reduce formation of chromia oxide layer and improve electrical conductivity of SOFC interconnects. |
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