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Stress Analysis Of Stretchable Thermal Sensor

This paper present a summary of the performance of modelling for stretchable circuit. For this new technology, the stretchable board can achieve mechanically bendable and stretchable by using the elastomer based substrate and interconnect. Hence, the study on mechanical properties of substrate effec...

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Main Author: Lee, Mei Wen
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
T Technology (General)
Online Access:http://eprints.usm.my/54399/1/Stress%20Analysis%20Of%20Stretchable%20Thermal%20Sensor_Lee%20Mei%20Wen_2017.pdf
http://eprints.usm.my/54399/
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spelling my.usm.eprints.54399 http://eprints.usm.my/54399/ Stress Analysis Of Stretchable Thermal Sensor Lee, Mei Wen T Technology T Technology (General) This paper present a summary of the performance of modelling for stretchable circuit. For this new technology, the stretchable board can achieve mechanically bendable and stretchable by using the elastomer based substrate and interconnect. Hence, the study on mechanical properties of substrate effect on design of interconnect is important on the fatigue lifetime and reliability of circuit. Nowadays, the reliability of stretchable circuit is still an existing issue when it continuously supplied by cyclic stresses which will cause the elastic strain deformation during stretch and compress. The purpose of this paper is to present the stress and strain deformation on the interconnect design and reliability of stretchable circuit. By using the Finite Element Method (FEM), it enables to define a more reliable design and suitable material of the stretchable circuit. The stretchability performance can be evaluated on the strain and stress applied to the interconnect and substrate. Suitable material properties of substrate able to offer the less damage during elongation. PDMS and TPU are chosen as material of substrates because of its high elongation before break and it allows high stretchability. This study demonstrates the effect of stress and strain deformation on new design of stretchable board by using proposed material for the substrates at different elongation. Universiti Sains Malaysia 2017-06-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54399/1/Stress%20Analysis%20Of%20Stretchable%20Thermal%20Sensor_Lee%20Mei%20Wen_2017.pdf Lee, Mei Wen (2017) Stress Analysis Of Stretchable Thermal Sensor. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
T Technology (General)
spellingShingle T Technology
T Technology (General)
Lee, Mei Wen
Stress Analysis Of Stretchable Thermal Sensor
description This paper present a summary of the performance of modelling for stretchable circuit. For this new technology, the stretchable board can achieve mechanically bendable and stretchable by using the elastomer based substrate and interconnect. Hence, the study on mechanical properties of substrate effect on design of interconnect is important on the fatigue lifetime and reliability of circuit. Nowadays, the reliability of stretchable circuit is still an existing issue when it continuously supplied by cyclic stresses which will cause the elastic strain deformation during stretch and compress. The purpose of this paper is to present the stress and strain deformation on the interconnect design and reliability of stretchable circuit. By using the Finite Element Method (FEM), it enables to define a more reliable design and suitable material of the stretchable circuit. The stretchability performance can be evaluated on the strain and stress applied to the interconnect and substrate. Suitable material properties of substrate able to offer the less damage during elongation. PDMS and TPU are chosen as material of substrates because of its high elongation before break and it allows high stretchability. This study demonstrates the effect of stress and strain deformation on new design of stretchable board by using proposed material for the substrates at different elongation.
format Monograph
author Lee, Mei Wen
author_facet Lee, Mei Wen
author_sort Lee, Mei Wen
title Stress Analysis Of Stretchable Thermal Sensor
title_short Stress Analysis Of Stretchable Thermal Sensor
title_full Stress Analysis Of Stretchable Thermal Sensor
title_fullStr Stress Analysis Of Stretchable Thermal Sensor
title_full_unstemmed Stress Analysis Of Stretchable Thermal Sensor
title_sort stress analysis of stretchable thermal sensor
publisher Universiti Sains Malaysia
publishDate 2017
url http://eprints.usm.my/54399/1/Stress%20Analysis%20Of%20Stretchable%20Thermal%20Sensor_Lee%20Mei%20Wen_2017.pdf
http://eprints.usm.my/54399/
_version_ 1743107825071030272
score 13.211869

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