The Application Of The DMAIC Techniques For Business Performances Case Study For Open Defect Of Single-Sided Flexible Circuit Board
Manufacturing company all around the world are facing the turbulent economic condition. This include global competition, customer demand for high quality productand reduced in lead time. In respond this need, various tools and tehniques have been developed. The lean principles tools are one of the s...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54372/1/The%20Application%20Of%20The%20DMAIC%20Techniques%20For%20Business%20Performances%20Case%20Study%20For%20Open%20Defect%20Of%20Single-Sided%20Flexible%20Circuit%20Board_Chua%20Khai%20Shen_M4_2018.pdf http://eprints.usm.my/54372/ |
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| Summary: | Manufacturing company all around the world are facing the turbulent economic condition. This include global competition, customer demand for high quality productand reduced in lead time. In respond this need, various tools and tehniques have been developed. The lean principles tools are one of the strategies developed to enhance productivity and quality performance. One of the lean technique is the DMAIC. It is a
methodology to solve the defect problem to increase the effectiveness and efficiency of the business performances is through “Continuous Process Improvement”. DMAIC is a data improvement cycle designed to applied on business process to find flaw or inefficiencies- particularly resulting in output defect. The target of this project is to reduce the open defect for the circuit on the Flexible Printed Circuit Board from 0.57% to 0.4% by implementation of DMAIC. From the record of Visual Inspection Yield Report, it is found that the Open defect is the main problem on the flexible printed circuit board. The part number (13236) has been choosen as the highest open defect problem for the research main focus. For this
study, Imaging area will be the main focus because it is related to the process formation of the circuit. The main two causes on imaging area are Contamination problem and Pin Hole. Hence the Six Sigma DMAIC methodology are initiated by
problem identification through the past record of the open defect. Then, the specification data of existing flexible printed circuit board are gathered. This is followed by the analysis and improvement steps, the tools such as trend chart, Cause-effect diagram. Then, evaluation form are distributed to understand the root cause of the process. At improvement and control phase, a series of solution (Checklist and standardisation ) are presented. With the implementation of the DMAIC solution, the result observed from January 2017 until January 2018, has shown that the overall open defect has decrease from 0.6%(17781 unit) decrease to 0.37%(4766 unit). While the part (13236) that have the highest defect also decrease from 0.68% (2644 unit) to 0.26% (132 unit). After the
improvement were conducted, the total accumulated saving cost from September 2017 till March 2018 are RM 1423.60. This can help company to increase the profitmargin in the long term. |
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