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Structural And Reliability Analysis Of Solder Joint Under Vibration Loading

Most of the devices nowadays contained electronic parts and often operated in vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decreas...

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Main Author: Ilias, Muhammad Ikmal
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54367/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading_Muhammad%20Ikmal%20Ilias_M4_2018.pdf
http://eprints.usm.my/54367/
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spelling my.usm.eprints.54367 http://eprints.usm.my/54367/ Structural And Reliability Analysis Of Solder Joint Under Vibration Loading Ilias, Muhammad Ikmal T Technology TJ Mechanical engineering and machinery Most of the devices nowadays contained electronic parts and often operated in vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decrease in size and cost. Hence, it is essential to investigate the structure of the solder joint and its reliability under vibration load. Models were simulated in structural analysis to simulate pull strength test to learn the structure and its strength while under random vibration to learn its behaviour and dynamic response under certain random frequency. Models were subjected to Y-axis displacement loading in structural analysis where as in random vibration analysis, the models are exposed to frequency range of 3 Hz to 500 Hz. Result from structural analysis shows that the structure of solder joint affects the strength of interconnection between circuit pad and LED joint. Higher number of adhesives able provide more strength to the structure. All parts of the CAD model were excited from the exposed frequency and failure occurred at some parts of the model at certain parameters. Overall, the research done allows the critical parameters of the models to be discovered of its behaviour in this analysis. Universiti Sains Malaysia 2018-05-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54367/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading_Muhammad%20Ikmal%20Ilias_M4_2018.pdf Ilias, Muhammad Ikmal (2018) Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TJ Mechanical engineering and machinery
spellingShingle T Technology
TJ Mechanical engineering and machinery
Ilias, Muhammad Ikmal
Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
description Most of the devices nowadays contained electronic parts and often operated in vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decrease in size and cost. Hence, it is essential to investigate the structure of the solder joint and its reliability under vibration load. Models were simulated in structural analysis to simulate pull strength test to learn the structure and its strength while under random vibration to learn its behaviour and dynamic response under certain random frequency. Models were subjected to Y-axis displacement loading in structural analysis where as in random vibration analysis, the models are exposed to frequency range of 3 Hz to 500 Hz. Result from structural analysis shows that the structure of solder joint affects the strength of interconnection between circuit pad and LED joint. Higher number of adhesives able provide more strength to the structure. All parts of the CAD model were excited from the exposed frequency and failure occurred at some parts of the model at certain parameters. Overall, the research done allows the critical parameters of the models to be discovered of its behaviour in this analysis.
format Monograph
author Ilias, Muhammad Ikmal
author_facet Ilias, Muhammad Ikmal
author_sort Ilias, Muhammad Ikmal
title Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
title_short Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
title_full Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
title_fullStr Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
title_full_unstemmed Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
title_sort structural and reliability analysis of solder joint under vibration loading
publisher Universiti Sains Malaysia
publishDate 2018
url http://eprints.usm.my/54367/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading_Muhammad%20Ikmal%20Ilias_M4_2018.pdf
http://eprints.usm.my/54367/
_version_ 1743107820787597312
score 13.211869

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