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Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles

The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, th...

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Main Author: Zulkurnain, Amru
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf
http://eprints.usm.my/54245/
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spelling my.usm.eprints.54245 http://eprints.usm.my/54245/ Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles Zulkurnain, Amru T Technology TJ Mechanical engineering and machinery The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, the reliability and sustainability of the integrated circuit (IC) is improved. The introduction of higher amount of filler particles in the encapsulant in turn increasing the filling time of the underfilling process significantly. It has been found that the higher filler loading causing the encapsulant to become more viscous. In this research, straight forward solution to this is by incorporating additional energy during the underfilling process. In this research, simulation and experimental analysis is conducted to study the effect of thermal energy to the filling time of composite underfilling time at different filler loading. For simulation, finite volume method (FVM) based numerical solver using discrete phase model (DPM). From simulation and experimental results, it is proven that the thermal energy is able to reduce the filling time of the underfilling process between difference filler loading by average of 5%. Universiti Sains Malaysia 2018-05-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf Zulkurnain, Amru (2018) Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TJ Mechanical engineering and machinery
spellingShingle T Technology
TJ Mechanical engineering and machinery
Zulkurnain, Amru
Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
description The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, the reliability and sustainability of the integrated circuit (IC) is improved. The introduction of higher amount of filler particles in the encapsulant in turn increasing the filling time of the underfilling process significantly. It has been found that the higher filler loading causing the encapsulant to become more viscous. In this research, straight forward solution to this is by incorporating additional energy during the underfilling process. In this research, simulation and experimental analysis is conducted to study the effect of thermal energy to the filling time of composite underfilling time at different filler loading. For simulation, finite volume method (FVM) based numerical solver using discrete phase model (DPM). From simulation and experimental results, it is proven that the thermal energy is able to reduce the filling time of the underfilling process between difference filler loading by average of 5%.
format Monograph
author Zulkurnain, Amru
author_facet Zulkurnain, Amru
author_sort Zulkurnain, Amru
title Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
title_short Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
title_full Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
title_fullStr Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
title_full_unstemmed Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
title_sort effect of thermal energy on the filling time of composite encapsulant underfilling process with various filler loading of nano silica filler particles
publisher Universiti Sains Malaysia
publishDate 2018
url http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf
http://eprints.usm.my/54245/
_version_ 1743107804400451584
score 13.211869

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