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Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange

The chemical mechanical polishing slurry is widely used in the semiconductor industry as a polishing agent to polish the surface of wafer. The polishing process involve the chemical and mechanical action to remove the modified layer on the surface of the wafer by tungsten slurry. The recovery of the...

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Main Author: Ahmad, Nur Husni
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TP Chemical Technology
Online Access:http://eprints.usm.my/53690/1/Effect%20Of%20pH%20On%20Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Slurry%20Using%20Dowex%20Marathon%20C%20Resin%20Of%20Ion%20Exchang_Nur%20Husni%20Ahmad_K4_2018.pdf
http://eprints.usm.my/53690/
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spelling my.usm.eprints.53690 http://eprints.usm.my/53690/ Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange Ahmad, Nur Husni T Technology TP Chemical Technology The chemical mechanical polishing slurry is widely used in the semiconductor industry as a polishing agent to polish the surface of wafer. The polishing process involve the chemical and mechanical action to remove the modified layer on the surface of the wafer by tungsten slurry. The recovery of the tungsten slurry is important to help reducing the cost of operation and reduce the production of wastewater by the industry. The recovery of spent tungsten slurry is study by using the ion exchange process by using the cation resin. Cation resin used is classified as strong acid cation exchange which is the Dowex Marathon C resin. The parameter that consider in this study is the pH different of the spent tungsten slurry. The study on the characterization of the tungsten slurry is vital to understand the best recovery method for the tungsten slurry. The study of characterization of tungsten slurry involve the pH, metal content, conductivity, zeta potential and mean particle size where the change in pH of slurry will affected the conductivity, zeta potential and mean particle size of the slurry. The pH used in this study is 3.84, 5.26, 8.50 and 10.84 with amount of resin used is 5g, volume of spent slurry is 150 mL and time contact between resin and slurry is 120 minutes. As a conclusion, the removal of tungsten showed that the best removal in the acidic pH with 9.70% removal at pH 3.84 and the iron removal from slurry showed that the best removal is when the pH is alkali with 39.49% at pH 10.84. Universiti Sains Malaysia 2018-06-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/53690/1/Effect%20Of%20pH%20On%20Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Slurry%20Using%20Dowex%20Marathon%20C%20Resin%20Of%20Ion%20Exchang_Nur%20Husni%20Ahmad_K4_2018.pdf Ahmad, Nur Husni (2018) Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Kimia. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TP Chemical Technology
spellingShingle T Technology
TP Chemical Technology
Ahmad, Nur Husni
Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
description The chemical mechanical polishing slurry is widely used in the semiconductor industry as a polishing agent to polish the surface of wafer. The polishing process involve the chemical and mechanical action to remove the modified layer on the surface of the wafer by tungsten slurry. The recovery of the tungsten slurry is important to help reducing the cost of operation and reduce the production of wastewater by the industry. The recovery of spent tungsten slurry is study by using the ion exchange process by using the cation resin. Cation resin used is classified as strong acid cation exchange which is the Dowex Marathon C resin. The parameter that consider in this study is the pH different of the spent tungsten slurry. The study on the characterization of the tungsten slurry is vital to understand the best recovery method for the tungsten slurry. The study of characterization of tungsten slurry involve the pH, metal content, conductivity, zeta potential and mean particle size where the change in pH of slurry will affected the conductivity, zeta potential and mean particle size of the slurry. The pH used in this study is 3.84, 5.26, 8.50 and 10.84 with amount of resin used is 5g, volume of spent slurry is 150 mL and time contact between resin and slurry is 120 minutes. As a conclusion, the removal of tungsten showed that the best removal in the acidic pH with 9.70% removal at pH 3.84 and the iron removal from slurry showed that the best removal is when the pH is alkali with 39.49% at pH 10.84.
format Monograph
author Ahmad, Nur Husni
author_facet Ahmad, Nur Husni
author_sort Ahmad, Nur Husni
title Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
title_short Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
title_full Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
title_fullStr Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
title_full_unstemmed Effect Of pH On Tungsten Removal From Chemical Mechanical Polishing (CMP) Slurry Using Dowex Marathon C Resin Of Ion Exchange
title_sort effect of ph on tungsten removal from chemical mechanical polishing (cmp) slurry using dowex marathon c resin of ion exchange
publisher Universiti Sains Malaysia
publishDate 2018
url http://eprints.usm.my/53690/1/Effect%20Of%20pH%20On%20Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Slurry%20Using%20Dowex%20Marathon%20C%20Resin%20Of%20Ion%20Exchang_Nur%20Husni%20Ahmad_K4_2018.pdf
http://eprints.usm.my/53690/
_version_ 1739829013478637568
score 13.211869

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