Microstructure Evolution Of Isothermally Aged Ecaped Sac Solder Alloy
In recent years, Sn-Ag-Cu solder alloy has been found to be amongst the suitable candidate for replacement of the conventional tin-lead (Sn-Pb) solder. Despite the advantages of SAC solder, the current demand of interconnect material prefers a higher mechanical properties of solder which would provi...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2017
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| Online Access: | http://eprints.usm.my/52552/1/Microstructure%20Evolution%20Of%20Isothermally%20Aged%20Ecaped%20Sac%20Solder%20Alloy_Nur%20Amiera%20Zulkifli_B1_2017.pdf http://eprints.usm.my/52552/ |
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