Compact Dual-Layer Siw Structure For Wireless System Solution
The challenge to acquire new and realistic means to demonstrate innovative RF system solution has lead designers to pursue and optimize available multilayer transition design. In this research, design properties and versatility exhibited in SIW technology has been explored, realized, and then charac...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Subjects: | |
| Online Access: | http://eprints.usm.my/45750/1/Compact%20Dual-Layer%20Siw%20Structure%20For%20Wireless%20System%20Solution.pdf http://eprints.usm.my/45750/ |
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| Summary: | The challenge to acquire new and realistic means to demonstrate innovative RF system solution has lead designers to pursue and optimize available multilayer transition design. In this research, design properties and versatility exhibited in SIW technology has been explored, realized, and then characterized in a proposed dual-layer SIW structure for possible RF system solution at 10 GHz. The proposed dual-layer SIW structure consists of two low loss SMA-microstrip taper-via transition, and two manually stacked SIW structures electrically connected via a small slot coupling. The slot coupling is designed and modeled based on two different shapes; rectangular slot coupling and cross slot coupling for bandwidth enhancement. Each of the slot coupling design are optimized using parametric studies. All the proposed structures are designed and modeled using CST and ADS software, respectively. Then, they are realized using conventional Printed Circuit Board (PCB) technology on Rogers 4003C with |
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