Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package...
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| Format: | Thesis |
| Language: | English |
| Published: |
2012
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| Online Access: | http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf http://eprints.usm.my/41921/ |
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| Summary: | Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge. |
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